Invention Grant
US09343596B2 Method for producing at least one radiation-emitting and/or -receiving semiconductor component, and semiconductor component
有权
用于产生至少一个辐射发射和/或接收半导体部件和半导体部件的方法
- Patent Title: Method for producing at least one radiation-emitting and/or -receiving semiconductor component, and semiconductor component
- Patent Title (中): 用于产生至少一个辐射发射和/或接收半导体部件和半导体部件的方法
-
Application No.: US14347594Application Date: 2012-09-21
-
Publication No.: US09343596B2Publication Date: 2016-05-17
- Inventor: Magnus Ahlstedt , Johann Ramchen
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE102011115150 20110927
- International Application: PCT/EP2012/068683 WO 20120921
- International Announcement: WO2013/045371 WO 20130404
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/0232 ; H01L33/54 ; H01L33/58 ; H01L33/62
Abstract:
A method for producing a radiation-emitting or radiation-receiving semiconductor component is specified. In a method step, a carrier body having a mounting surface is provided. In a further method step, a barrier frame is formed on the mounting surface, in such a way that the barrier frame laterally encloses a mounting region of the mounting surface. In a further method step, a radiation-emitting or radiation-receiving semiconductor chip is mounted within the mounting region on the mounting surface. The semiconductor chip is potted with a liquid lens material, wherein the lens material is applied to the mounting surface within the mounting region. The lens material is cured. The mounting surface, the barrier frame and the lens material are adapted to one another.
Public/Granted literature
Information query
IPC分类:
