Invention Grant
- Patent Title: Heterojunction semiconductor device and manufacturing method
- Patent Title (中): 异质结半导体器件及其制造方法
-
Application No.: US14714927Application Date: 2015-05-18
-
Publication No.: US09349819B2Publication Date: 2016-05-24
- Inventor: Godefridus Adrianus Maria Hurkx , Jeroen Antoon Croon , Johannes Josephus Theodorus Marinus Donkers , Jan Sonsky , Stephen John Sque , Andreas Bernardus Maria Jansman , Markus Mueller , Stephan Heil , Tim Boettcher
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP12168884 20120522
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L21/02 ; H01L29/47 ; H01L29/417 ; H01L29/423 ; H01L29/778 ; H01L29/872 ; H01L29/40

Abstract:
Disclosed is a semiconductor device comprising a group 13 nitride heterojunction comprising a first layer having a first bandgap and a second layer having a second bandgap, wherein the first layer is located between a substrate and the second layer; and a Schottky electrode and a first further electrode each conductively coupled to a different area of the heterojunction, said Schottky electrode comprising a central region and an edge region, wherein the element comprises a conductive barrier portion located underneath said edge region only of the Schottky electrode for locally increasing the Schottky barrier of the Schottky electrode. A method of manufacturing such a semiconductor device is also disclosed.
Public/Granted literature
- US20160020296A1 HETEROJUNCTION SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD Public/Granted day:2016-01-21
Information query
IPC分类: