Invention Grant

IGBT and diode
Abstract:
In an IGBT, defects generated by ion implantation for introduction of the P-type collector region or N-type buffer region into the N−-type drift region near the N-type buffer region remain to improve the switching speed, however the leak current increases by bringing a depletion layer into contact with the crystal defects at the off time. To avoid this, an IGBT is provided which includes an N-type buffer region having a higher concentration than that of an N−-type drift region and being in contact with a P-type on its backside, and a defect remaining region provided near the boundary between the N-type buffer region and the N−-type drift region. The N−-type drift region located on the front surface side with respect to the defect remaining region is provided with an N-type field stopping region having a higher concentration than that of the N−-type drift region.
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