Invention Grant
- Patent Title: Sub-lithographic patterning of magnetic tunneling junction devices
- Patent Title (中): 磁性隧道结装置的次光刻图案化
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Application No.: US14483919Application Date: 2014-09-11
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Publication No.: US09362336B2Publication Date: 2016-06-07
- Inventor: Yu Lu
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Seyfarth Shaw LLP
- Main IPC: H01L29/82
- IPC: H01L29/82 ; H01L27/22 ; H01L43/02 ; H01L43/08 ; H01L43/12 ; G11C11/16

Abstract:
A method for fabricating a magnetic tunnel junction (MTJ) device includes creating a recess within a second patterning layer, in which a first patterning layer overhangs the recessed second patterning layer. Such a method further includes depositing a film into the recess to create a keyhole pattern within the deposited film. The method further includes transferring the keyhole pattern through a hard mask layer to an MTJ stack. The method also includes depositing a conductive material into the transferred keyhole pattern and on an MTJ stack. The method also includes removing the hard mask layer to create a conductive hard mask pillar.
Public/Granted literature
- US20160079307A1 SUB-LITHOGRAPHIC PATTERNING OF MAGNETIC TUNNELING JUNCTION DEVICES Public/Granted day:2016-03-17
Information query
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