Invention Grant
- Patent Title: Motion sensor and packaging method thereof
- Patent Title (中): 运动传感器及其包装方法
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Application No.: US14264038Application Date: 2014-04-28
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Publication No.: US09377354B2Publication Date: 2016-06-28
- Inventor: Ming-Hsun Hsieh
- Applicant: LITE-ON SEMICONDUCTOR CORPORATION
- Applicant Address: TW Hsin-Tien Dist., New Taipei
- Assignee: Dyna Image Corporation
- Current Assignee: Dyna Image Corporation
- Current Assignee Address: TW Hsin-Tien Dist., New Taipei
- Agent Winston Hsu; Scott Margo
- Priority: CN201310727571 20131225
- Main IPC: G01J1/42
- IPC: G01J1/42 ; H01L25/00 ; H01L25/16 ; H05K13/04 ; H01L31/0232 ; G06F3/0354 ; G06K9/60 ; G06T5/00 ; G06F13/24 ; G01S7/481 ; G01S17/50 ; G06F3/03 ; H01L27/146
Abstract:
A motion sensor includes: a substrate, which includes a plurality of lead frame layers and a plurality of ceramic layers; a light source, disposed on the substrate, for emitting light; a sensing device, disposed on the substrate, for receiving the light to perform motion sensing; a cover, for fixing and protecting the light source and the sensing device; and an adhesive, for gluing the cover to the substrate, the adhesive including a component capable of blocking the light; wherein the light is infrared light, visible light or ultraviolet light.
Public/Granted literature
- US20140319328A1 MOTION SENSOR AND PACKAGING METHOD THEREOF Public/Granted day:2014-10-30
Information query
