Invention Grant
- Patent Title: Optical-electro circuit board, optical component and manufacturing method thereof
- Patent Title (中): 光电路板,光学元件及其制造方法
-
Application No.: US14337248Application Date: 2014-07-22
-
Publication No.: US09377596B2Publication Date: 2016-06-28
- Inventor: Yin-Ju Chen , Cheng-Po Yu , Pei-Chang Huang
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: Jianq Chyun IP Office
- Main IPC: G02B6/43
- IPC: G02B6/43 ; G02B6/42 ; H01L31/0232

Abstract:
An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.
Public/Granted literature
- US20160025944A1 OPTICAL-ELECTRO CIRCUIT BOARD, OPTICAL COMPONENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-01-28
Information query