发明授权
- 专利标题： Light emitting device and method for manufacturing the same including a light-reflective resin
- 专利标题（中）： 发光元件及其制造方法，包括光反射树脂
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申请号： US14616568申请日： 2015-02-06
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公开(公告)号： US09379094B2公开(公告)日： 2016-06-28
- 发明人: Satoshi Wada , Kosei Fukui , Takashi Nonogawa
- 申请人： TOYODA GOSEI CO., LTD.
- 申请人地址： JP Kiyosu-shi, Aichi-ken
- 专利权人： TOYODA GOSEI CO., LTD.
- 当前专利权人： TOYODA GOSEI CO., LTD.
- 当前专利权人地址： JP Kiyosu-shi, Aichi-ken
- 代理机构： McGinn IP Law Group PLLC
- 优先权： JP2014-048361 20140312; JP2014-183831 20140910
- 主分类号： H01L25/16
- IPC分类号： H01L25/16 ; H01L29/866 ; H01L33/50 ; H01L33/54 ; H01L33/60 ; H01L33/46 ; H01L25/075 ; H05B33/08 ; H01L33/56
摘要：
A light emitting device includes a substrate, a light-emitting diode chip mounted on the substrate, a Zener diode chip mounted next to the light-emitting diode chip on the substrate, a frame-like dam material formed on the substrate to surround the light-emitting diode chip and the Zener diode chip, and a light-reflective resin injected inside the dam material to coat side surfaces of the light-emitting diode chip and side surfaces and an upper surface of the Zener diode chip. A part of the frame-like dam material swells outward to surround three of the side surfaces of the Zener diode chip.
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