Invention Grant
- Patent Title: Release layer, substrate structure, and method for manufacturing flexible electronic device
- Patent Title (中): 剥离层，基板结构以及柔性电子器件的制造方法
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Application No.: US14264742Application Date: 2014-04-29
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Publication No.: US09388278B2Publication Date: 2016-07-12
- Inventor: Chih-Cheng Lin , Chyi-Ming Leu , Yu-Ju Kuo
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW103107366A 20140305
- Main IPC: C08G73/10
- IPC: C08G73/10 ; C09D179/08 ; B32B43/00 ; B32B37/16 ; B32B38/00
Abstract:
Disclosed is a substrate structure for manufacturing a flexible electronic device, including a supporting layer, a release layer covering the supporting layer with a first area, wherein the release layer is an aromatic polyimide, and a flexible layer covering the supporting layer and the release layer with a second area. The second area is greater than the first area. The adhesion force between the flexible layer and the supporting layer is stronger than the adhesion force between the release layer and the supporting layer.
Public/Granted literature
- US20150099088A1 RELEASE LAYER, SUBSTRATE STRUCTURE, AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE Public/Granted day:2015-04-09
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