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公开(公告)号：US10995237B2
公开(公告)日：2021-05-04
申请号：US16234073
申请日：2018-12-27
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Dong-Sen Chen , Yu-Ju Kuo , Chyi-Ming Leu
Abstract: A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, from 5 to 20 parts by weight of silica particles, from 5 to 80 parts by weight of an alkoxysilane, and from 40 to 80 parts by weight of a solvent.
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公开(公告)号：US09707706B2
公开(公告)日：2017-07-18
申请号：US14627913
申请日：2015-02-20
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Chun-Wei Su , Chyi-Ming Leu , Yu-Ju Kuo , Hong-Ching Lin , Chun-An Lu , Chiung-Hsiung Chen
CPC classification number: B29C39/02 , B29C35/02 , B29C39/003 , B29K2027/16 , B29K2079/08 , B29K2505/00 , B29K2995/0005 , B29L2031/3425 , H05K3/207 , H05K2201/0154 , H05K2201/2072 , H05K2203/1131
Abstract: A flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires providing a carrier; forming a continuous wire pattern on the carrier, the continuous wire pattern containing a plurality of pores; covering a polymer material over the continuous wire pattern and the carrier and to fill into the pores; and separating the polymer material and the carrier to form a flexible substrate embedded with the continuous wire pattern” where the only change is the addition of wires.
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公开(公告)号：US11667757B2
公开(公告)日：2023-06-06
申请号：US17139336
申请日：2020-12-31
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Dong-Sen Chen , Yu-Ju Kuo , Yung-Lung Tseng , Chun-Wei Su
IPC: C08G77/455 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/24 , C08G77/26 , C08G77/00 , C08G73/10 , C08K5/00 , C08L79/08 , C08G77/12
CPC classification number: C08G77/455 , C08G73/1039 , C08G73/1046 , C08G73/1064 , C08G73/1067 , C08G73/1075 , C08G73/1085 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/24 , C08G77/26 , C08G77/80 , C08K5/0025 , C08L79/08 , C08L2201/10 , C08L2203/20
Abstract: A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II)
wherein A1 and A3 are independently tetravalent moiety; A2 is a divalent moiety; n≥1; m≥1; R1 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, or C6-12 aryl; and R2 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, C6-12 aryl, or a reactive functional group.-
4.发明授权Release layer, substrate structure, and method for manufacturing flexible electronic device 有权剥离层，基板结构以及柔性电子器件的制造方法公开(公告)号：US09388278B2
公开(公告)日：2016-07-12
申请号：US14264742
申请日：2014-04-29
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Chih-Cheng Lin , Chyi-Ming Leu , Yu-Ju Kuo
IPC: C08G73/10 , C09D179/08 , B32B43/00 , B32B37/16 , B32B38/00
CPC classification number: C08G73/1067 , B32B37/16 , B32B38/105 , B32B43/006 , B32B2379/08 , B32B2457/00 , B32B2457/14 , C09D179/08
Abstract: Disclosed is a substrate structure for manufacturing a flexible electronic device, including a supporting layer, a release layer covering the supporting layer with a first area, wherein the release layer is an aromatic polyimide, and a flexible layer covering the supporting layer and the release layer with a second area. The second area is greater than the first area. The adhesion force between the flexible layer and the supporting layer is stronger than the adhesion force between the release layer and the supporting layer.
Abstract translation: 公开了一种用于制造柔性电子器件的衬底结构，包括支撑层，覆盖支撑层的第一区域的剥离层，其中剥离层是芳族聚酰亚胺，以及覆盖支撑层和剥离层的柔性层 第二个区域。 第二个区域大于第一个区域。 柔性层和支撑层之间的粘附力比剥离层和支撑层之间的粘合力更强。
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