Invention Grant
- Patent Title: Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens
- Patent Title (中): 使用具有倾斜物镜的白光干涉仪在线检查导电迹线和基板之间的隐藏缺陷的接触
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Application No.: US14229446Application Date: 2014-03-28
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Publication No.: US09389064B2Publication Date: 2016-07-12
- Inventor: Shuhong Liu , Zhiyong Wang , Nilanjan Ghosh , Deepak Goyal
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G01B11/02
- IPC: G01B11/02 ; G01B9/02 ; G01B11/06 ; G01N21/956 ; G02B21/00

Abstract:
Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing formed on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.
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