公开(公告)号：US09389064B2

公开(公告)日：2016-07-12

申请号：US14229446

申请日：2014-03-28

Applicant: Intel Corporation

Inventor： Shuhong Liu ,  Zhiyong Wang ,  Nilanjan Ghosh ,  Deepak Goyal

IPC: G01B11/02 ,  G01B9/02 ,  G01B11/06 ,  G01N21/956 ,  G02B21/00

CPC classification number: G01N21/9501 ,  G01B9/0203 ,  G01B9/0209 ,  G01B11/0675 ,  G01B2210/56 ,  G01N21/956 ,  G02B21/0016

Abstract: Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing formed on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.

Abstract translation: 实施例包括使用具有倾斜物镜的白光干涉仪（WLI）显微镜的装置，系统和方法，以执行两种抗蚀剂基础缺陷和导电迹线底切缺陷的在线监测。 可以在干膜抗蚀剂（DFR）底脚与形成在包装基材的绝缘层顶表面上的导电迹线基底之间的界面处检测到缺陷。 这种基础和底切缺陷可能被认为是“隐藏的缺陷”。 使用具有倾斜物镜的WLI显微镜为非破坏性，非接触式在线监测提供了高吞吐量和低成本的计量和工具。

公开(公告)号：US20170170080A1

公开(公告)日：2017-06-15

申请号：US14968401

申请日：2015-12-14

Applicant: Intel Corporation

Inventor： Darko Grujicic ,  Nilanjan Ghosh ,  Marcel A. Wall ,  Deepak Goyal

IPC: H01L21/66 ,  H01L21/288 ,  H01L21/285 ,  C23C14/54 ,  H01L21/67 ,  C23C18/16 ,  C23C14/34 ,  H01L21/48 ,  H01L21/3213

CPC classification number: H01L22/26 ,  C23C14/34 ,  C23C14/542 ,  C23C18/1633 ,  C23C18/1671 ,  C23C18/1675 ,  C23C18/38 ,  H01L21/4814 ,  H01L21/4846 ,  H01L21/67253 ,  H01L22/14

Abstract: A material thickness adjustment device and associated methods are shown. Material thickness adjustment devices and methods shown include eddy current measurement to determine material thickness during a deposition or removal operation. Feedback from the measured thickness may then be applied to adjust one or more processing parameters to meet a desired thickness.