发明授权
- 专利标题: High bandwidth connector for internal and external IO interfaces
- 专利标题(中): 用于内部和外部IO接口的高带宽连接器
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申请号: US13996004申请日: 2011-12-23
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公开(公告)号: US09391378B2公开(公告)日: 2016-07-12
- 发明人: Michael Leddige , Yun Ling , Kuan-Yu Chen , Kai Wang , Xiang Li , Howard Heck
- 申请人: Michael Leddige , Yun Ling , Kuan-Yu Chen , Kai Wang , Xiang Li , Howard Heck
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Jordan IP Law, LLC
- 国际申请: PCT/US2011/067163 WO 20111223
- 国际公布: WO2013/095628 WO 20130627
- 主分类号: H01R4/48
- IPC分类号: H01R4/48 ; H01R12/72 ; H01R13/24 ; H01R12/71 ; H01R43/18 ; H01R13/66
摘要:
Methods and systems to support input output (IO) communications may include an IO connector having a housing with surfaces defining a paddle card region, and a set of compressible contacts extending vertically through the housing into the paddle card region. In addition, an IO interconnect can include a cable portion and at least one end portion coupled to the cable portion. The end portion may include a paddle card having a circuit board with a set of contacts disposed on a bottom surface of the circuit board. The end portion can also include an asymmetric metal shell having a configuration that encloses at least a portion of the paddle card and exposes the set of contacts.
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