发明授权
- 专利标题： Photoresist composition
- 专利标题（中）： 光刻胶组成
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申请号： US14573624申请日： 2014-12-17
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公开(公告)号： US09417526B2公开(公告)日： 2016-08-16
- 发明人: Jun Chun , Jeong-Min Park , Sung-Kyun Park , Ji-Hyun Kim , Jin-Ho Ju , Hyoc-Min Youn , Dong-Myung Kim , Jin-Sun Kim , Tai-Hoon Yeo , Byung-Uk Kim
- 申请人： SAMSUNG DISPLAY CO., LTD.
- 申请人地址： KR Yongin, Gyeonggi-do
- 专利权人： SAMSUNG DISPLAY CO., LTD.
- 当前专利权人： SAMSUNG DISPLAY CO., LTD.
- 当前专利权人地址： KR Yongin, Gyeonggi-do
- 代理机构： Lee & Morse, P.C.
- 优先权： KR10-2014-0006654 20140120
- 主分类号： G03F7/004
- IPC分类号： G03F7/004 ; G03F7/038 ; G03F7/30 ; C08F220/10 ; C08F220/26 ; C08F220/16 ; C08F220/18 ; C08F212/34 ; H01L51/10 ; H01L21/027 ; H01L21/311 ; G02F1/1362
摘要：
A photoresist composition includes an acid-labile polymer that is decomposable by reaction with an acid, a photoacid generator, an organic base having a pKa value of 9 or less and a solvent. Based on 100 parts by weight of the acid-labile polymer, the photoacid generator is about 1 to about 30 parts by weight, and the organic base is about 0.1 to about 5 parts by weight. The solvent is about 50 to about 90 wt % based on the total weight of the composition.
公开/授权文献
- US20150205204A1 PHOTORESIST COMPOSITION 公开/授权日：2015-07-23
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