Invention Grant
US09426896B2 Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure
有权
绝缘树脂膜，使用绝缘树脂膜的结合结构和粘结结构的制造方法
- Patent Title: Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure
- Patent Title (中): 绝缘树脂膜，使用绝缘树脂膜的结合结构和粘结结构的制造方法
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Application No.: US14278810Application Date: 2014-05-15
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Publication No.: US09426896B2Publication Date: 2016-08-23
- Inventor: Daisuke Sato , Junichi Nishimura , Ryosuke Odaka
- Applicant: Dexerials Corporation
- Applicant Address: JP Tokyo
- Assignee: Dexerials Corporation
- Current Assignee: Dexerials Corporation
- Current Assignee Address: JP Tokyo
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Priority: JP2009-139483 20090610; JP2010-045247 20100302
- Main IPC: H05K3/30
- IPC: H05K3/30 ; C09J7/02 ; C09J163/00 ; H01L23/00 ; C08K3/00
Abstract:
To provide an insulating resin film, which contains: a first adhesive layer; and a second adhesive layer, wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part, wherein the first adhesive layer and the second adhesive layer each contain inorganic filler, wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and wherein a thickness of the first adhesive layer is 50% to 90% of a total thickness of the insulating resin film.
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