公开(公告)号：US12014840B2

公开(公告)日：2024-06-18

申请号：US17315862

申请日：2021-05-10

Applicant: DEXERIALS CORPORATION

Inventor： Junichi Nishimura

IPC: H01B1/20 ,  H01B1/22 ,  H01B5/16 ,  H01B13/34 ,  H01L23/00 ,  H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K3/32

CPC classification number: H01B1/22 ,  H01B5/16 ,  H01B13/34 ,  H01L24/83 ,  H01R4/04 ,  H01R11/01 ,  H01R43/00

Abstract: Provided is an anisotropic conductive film manufacturing method capable of reducing manufacturing costs. Also provided is an anisotropic conductive film capable of suppressing the occurrence of conduction defects. The anisotropic conductive film manufacturing method includes: a holding step of supplying conductive particles having a plurality of particle diameters on a member having a plurality of opening parts, and holding the conductive particles in the opening parts; and a transfer step of transferring the conductive particles held in the opening parts to an adhesive film. In the particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the conductive particles held in the opening parts, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter.

公开(公告)号：US11004574B2

公开(公告)日：2021-05-11

申请号：US16087526

申请日：2017-04-25

Applicant: DEXERIALS CORPORATION

Inventor： Junichi Nishimura

IPC: H01B1/20 ,  H05K3/32 ,  H01B1/22 ,  H01B13/34 ,  H01R43/00 ,  H01R11/01 ,  H01B5/16 ,  H01R4/04 ,  H01L23/00

Abstract: An anisotropic conductive film manufacturing method capable of reducing manufacturing costs. Also, an anisotropic conductive film capable of suppressing the occurrence of conduction defects. The anisotropic conductive film manufacturing method includes: a holding step of supplying conductive particles having a plurality of particle diameters on a member having a plurality of opening parts, and holding the conductive particles in the opening parts; and a transfer step of transferring the conductive particles held in the opening parts to an adhesive film. In the particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the conductive particles held in the opening parts, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter.

公开(公告)号：US09426896B2

公开(公告)日：2016-08-23

申请号：US14278810

申请日：2014-05-15

Applicant: Dexerials Corporation

Inventor： Daisuke Sato ,  Junichi Nishimura ,  Ryosuke Odaka

IPC: H05K3/30 ,  C09J7/02 ,  C09J163/00 ,  H01L23/00 ,  C08K3/00

CPC classification number: H05K3/30 ,  C08K3/01 ,  C09J7/35 ,  C09J163/00 ,  C09J2201/134 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29366 ,  H01L2224/29386 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K3/305 ,  H05K2201/0195 ,  H05K2201/0209 ,  Y02P70/613 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: To provide an insulating resin film, which contains: a first adhesive layer; and a second adhesive layer, wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part, wherein the first adhesive layer and the second adhesive layer each contain inorganic filler, wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and wherein a thickness of the first adhesive layer is 50% to 90% of a total thickness of the insulating resin film.

Abstract translation: 提供绝缘树脂膜，其包含：第一粘合剂层; 和第二粘合剂层，其中所述绝缘树脂膜被构造成将基板和电子部件结合在一起，并且所述第一粘合层设置在所述基板的一侧，并且所述第二粘合层设置在所述电子部件的一侧 其中，所述第一粘合剂层和所述第二粘合剂层各自含有无机填料，其中所述第二粘合剂层具有比所述第一粘合剂层的DSC放热峰值温度高的DSC放热峰值温度，并且其中所述第一粘合剂的厚度 层是绝缘树脂膜的总厚度的50％至90％。