Invention Grant
US09431267B2 Semiconductor device processing tools and methods for patterning substrates
有权
用于图案化衬底的半导体器件加工工具和方法
- Patent Title: Semiconductor device processing tools and methods for patterning substrates
- Patent Title (中): 用于图案化衬底的半导体器件加工工具和方法
-
Application No.: US14093503Application Date: 2013-12-01
-
Publication No.: US09431267B2Publication Date: 2016-08-30
- Inventor: Mayur Trivedi , Sushil Padiyar , Lakshmanan Karuppiah , Randhir Thakur
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dugan & Dugan, PC
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/308 ; H01L21/67
Abstract:
In some embodiments, an electronic device processing system is provided that includes a processing tool having a first subsystem configured to carry out a first subset of processes on a substrate having pattern features, the first subsystem including a first conformal deposition chamber and a first etch chamber. The processing tool includes a second subsystem coupled to the first subsystem and configured to carry out a second subset of processes on the substrate, the second subsystem including a second conformal deposition chamber and a second etch chamber. The processing tool is configured to employ the first and second subsystems to perform pitch division on the substrate within the processing tool so as to form a reduced-pitch pattern on the substrate. Numerous other embodiments are provided.
Public/Granted literature
- US20140154887A1 SEMICONDUCTOR DEVICE PROCESSING TOOLS AND METHODS FOR PATTERNING SUBSTRATES Public/Granted day:2014-06-05
Information query
IPC分类:
