Methods of forming semiconductor devices, including performing a heat treatment after forming a metal layer and a high-k layer

Invention Grant

US09431515B2 Methods of forming semiconductor devices, including performing a heat treatment after forming a metal layer and a high-k layer 有权

Title translation: 形成半导体器件的方法，包括在形成金属层和高k层之后进行热处理

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Patent Title: Methods of forming semiconductor devices, including performing a heat treatment after forming a metal layer and a high-k layer
Patent Title (中): 形成半导体器件的方法，包括在形成金属层和高k层之后进行热处理
Application No.: US14640058

Application Date: 2015-03-06
Publication No.: US09431515B2

Publication Date: 2016-08-30
Inventor: Seok-Jun Won , Weon-Hong Kim , Moon-Kyun Song
Applicant: Samsung Electronics Co., Ltd.
Applicant Address: KR
Assignee: Samsung Electronics Co., Ltd.
Current Assignee: Samsung Electronics Co., Ltd.
Current Assignee Address: KR
Agency: Myers Bigel & Sibley, P.A.
Priority: KR10-2014-0087307 20140711
Main IPC: H01L21/8238
IPC: H01L21/8238 ; H01L29/66 ; H01L21/28 ; H01L21/321 ; H01L29/49 ; H01L29/51

Methods of forming semiconductor devices, including performing a heat treatment after forming a metal layer and a high-k layer

Abstract:

Methods of forming semiconductor devices are provided. A method of forming a semiconductor device includes forming an insulating layer that includes a trench therein. The method includes forming a high-k layer in the trench. Moreover, the method includes forming a metal layer on the high-k layer, then performing a first heat treatment at a first temperature, and performing a second heat treatment at a second temperature that is higher than the first temperature.

Abstract(Chinese):

提供了形成半导体器件的方法。形成半导体器件的方法包括在其中形成包括沟槽的绝缘层。该方法包括在沟槽中形成高k层。此外，该方法包括在高k层上形成金属层，然后在第一温度下进行第一热处理，并在高于第一温度的第二温度下进行第二热处理。

Public/Granted literature

US20160013107A1 METHODS OF FORMING SEMICONDUCTOR DEVICES, INCLUDING PERFORMING A HEAT TREATMENT AFTER FORMING A METAL LAYER AND A HIGH-K LAYER Public/Granted day:2016-01-14

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Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS