Invention Grant
- Patent Title: High frequency integrated circuit and packaging for same
- Patent Title (中): 高频集成电路和封装相同
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Application No.: US14613005Application Date: 2015-02-03
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Publication No.: US09437558B2Publication Date: 2016-09-06
- Inventor: Andrew Pye , Rodrigo Carrillo-Ramirez
- Applicant: ANALOG DEVICES, INC.
- Applicant Address: US MA Norwood
- Assignee: ANALOG DEVICES, INC.
- Current Assignee: ANALOG DEVICES, INC.
- Current Assignee Address: US MA Norwood
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/66 ; H01L23/00
Abstract:
An integrated circuit can include a group of bond pads alternating between bond pads configured to provide a return path and bond pads configured to provide a signal bond pad. For example, five bond pads can be arranged in a return-signal-return-signal-return arrangement. The integrated circuit can further be configured to receive or transmit high frequency signals.
Public/Granted literature
- US20160190075A1 HIGH FREQUENCY INTEGRATED CIRCUIT AND PACKAGING FOR SAME Public/Granted day:2016-06-30
Information query
IPC分类:
