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公开(公告)号:US20150097637A1
公开(公告)日:2015-04-09
申请号:US14050181
申请日:2013-10-09
Applicant: ANALOG DEVICES, INC.
Inventor: Andrew Pye , Marc E. Goldfarb
CPC classification number: H03H11/04 , H01F21/12 , H01F27/2804 , H01F2021/125 , H03H7/01 , H03H7/0115 , H03H7/0153 , H03H7/09
Abstract: In one example embodiment, a programmable filter is provided, including a plurality of variable-inductance networks and a plurality of variable-capacitance networks. The programmable filter may be implemented in a classical filter topology, with variable-capacitance networks replacing discrete capacitors and variable-inductance networks replacing discrete inductors. An example variable-inductance network comprises a primary inductor with an intermediate tap, and secondary inductor connected at the intermediate tap, with switches for selecting an inductance.
Abstract translation: 在一个示例性实施例中,提供了可编程滤波器,包括多个可变电感网络和多个可变电容网络。 可编程滤波器可以在经典滤波器拓扑中实现,其中可变电容网络代替分立电容器和替代离散电感器的可变电感网络。 示例性可变电感网络包括具有中间抽头的初级电感器和在中间抽头处连接的次级电感器,用于选择电感的开关。
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公开(公告)号:US09172353B2
公开(公告)日:2015-10-27
申请号:US14050181
申请日:2013-10-09
Applicant: ANALOG DEVICES, INC.
Inventor: Andrew Pye , Marc E. Goldfarb
CPC classification number: H03H11/04 , H01F21/12 , H01F27/2804 , H01F2021/125 , H03H7/01 , H03H7/0115 , H03H7/0153 , H03H7/09
Abstract: In one example embodiment, a programmable filter is provided, including a plurality of variable-inductance networks and a plurality of variable-capacitance networks. The programmable filter may be implemented in a classical filter topology, with variable-capacitance networks replacing discrete capacitors and variable-inductance networks replacing discrete inductors. An example variable-inductance network comprises a primary inductor with an intermediate tap, and secondary inductor connected at the intermediate tap, with switches for selecting an inductance.
Abstract translation: 在一个示例性实施例中,提供了可编程滤波器,包括多个可变电感网络和多个可变电容网络。 可编程滤波器可以在经典滤波器拓扑中实现,其中可变电容网络代替分立电容器和替代离散电感器的可变电感网络。 示例性可变电感网络包括具有中间抽头的初级电感器和在中间抽头处连接的次级电感器,用于选择电感的开关。
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公开(公告)号:US20180123551A1
公开(公告)日:2018-05-03
申请号:US15366966
申请日:2016-12-01
Applicant: ANALOG DEVICES, INC.
Inventor: Andrew Pye
IPC: H03H7/42
CPC classification number: H03H7/422 , H01P5/10 , H03F1/565 , H03F3/189 , H03F3/45475 , H03F3/60 , H03F2200/06
Abstract: Coupled-line baluns with common-mode compensation are provided herein. In certain configurations, a series resistor-inductor (RL) network is connected to ports of a coupled-line balun to null the common-mode transmission coefficient at a desired frequency. This extends performance at lower frequencies by improving the low frequency amplitude and phase balance of the device. The inductor and resistor can be connected in series between one of the differential terminals and a single-ended grounded terminal. This advantageously can null the common-mode transmission at a specific frequency near a minimum length-dominated frequency so as to enhance the common-mode rejection at lower frequencies.
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公开(公告)号:US10122341B2
公开(公告)日:2018-11-06
申请号:US15366966
申请日:2016-12-01
Applicant: ANALOG DEVICES, INC.
Inventor: Andrew Pye
Abstract: Coupled-line baluns with common-mode compensation are provided herein. In certain configurations, a series resistor-inductor (RL) network is connected to ports of a coupled-line balun to null the common-mode transmission coefficient at a desired frequency. This extends performance at lower frequencies by improving the low frequency amplitude and phase balance of the device. The inductor and resistor can be connected in series between one of the differential terminals and a single-ended grounded terminal. This advantageously can null the common-mode transmission at a specific frequency near a minimum length-dominated frequency so as to enhance the common-mode rejection at lower frequencies.
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公开(公告)号:US09437558B2
公开(公告)日:2016-09-06
申请号:US14613005
申请日:2015-02-03
Applicant: ANALOG DEVICES, INC.
Inventor: Andrew Pye , Rodrigo Carrillo-Ramirez
IPC: H01L23/495 , H01L23/66 , H01L23/00
CPC classification number: H01L23/66 , H01L23/4952 , H01L23/49541 , H01L23/49575 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2223/6611 , H01L2223/6638 , H01L2224/04042 , H01L2224/05014 , H01L2224/05554 , H01L2224/0603 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/48257 , H01L2224/48644 , H01L2224/48647 , H01L2224/49113 , H01L2224/49175 , H01L2924/00011 , H01L2924/00014 , H01L2924/1421 , H01L2924/14215 , H01L2224/45015 , H01L2924/207 , H01L2924/01005 , H01L2224/05599
Abstract: An integrated circuit can include a group of bond pads alternating between bond pads configured to provide a return path and bond pads configured to provide a signal bond pad. For example, five bond pads can be arranged in a return-signal-return-signal-return arrangement. The integrated circuit can further be configured to receive or transmit high frequency signals.
Abstract translation: 集成电路可以包括在配置成提供返回路径的接合焊盘和被配置为提供信号接合焊盘的接合焊盘之间交替的一组接合焊盘。 例如,可以以返回信号返回信号返回装置布置五个接合焊盘。 集成电路还可以被配置为接收或发送高频信号。
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公开(公告)号:US10950542B2
公开(公告)日:2021-03-16
申请号:US16359450
申请日:2019-03-20
Applicant: Analog Devices, Inc.
Inventor: Luke Steigerwald , Marc E. Goldfarb , Andrew Pye , Simon Gay
IPC: H03F3/187 , H01L23/522 , H03H7/42 , H01L23/64 , H03F3/195 , H01L23/532 , H03G3/30 , H01L23/66
Abstract: One embodiment is an apparatus comprising a semiconductor integrated circuit (“IC”) chip comprising at least one active component for implementing an amplifier circuit; and a laminate structure comprising a plurality of metal layers, the laminate structure further comprising a plurality of passive components and transmission line-based structures. The semiconductor IC chip is integrated with the laminate structure such that a top layer of the laminate structure comprises a shield over a top of the semiconductor IC chip and the passive components for limiting electromagnetic coupling of signals generated by the amplifier circuit beyond the laminate structure.
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公开(公告)号:US20200303302A1
公开(公告)日:2020-09-24
申请号:US16359450
申请日:2019-03-20
Applicant: Analog Devices, Inc.
Inventor: Luke Steigerwald , Marc E. Goldfarb , Andrew Pye , Simon Gay
IPC: H01L23/522 , H03H7/42 , H01L23/64 , H01L23/66 , H01L23/532 , H03G3/30 , H03F3/195
Abstract: One embodiment is an apparatus comprising a semiconductor integrated circuit (“IC”) chip comprising at least one active component for implementing an amplifier circuit; and a laminate structure comprising a plurality of metal layers, the laminate structure further comprising a plurality of passive components and transmission line-based structures. The semiconductor IC chip is integrated with the laminate structure such that a top layer of the laminate structure comprises a shield over a top of the semiconductor IC chip and the passive components for limiting magnetic coupling of signals generated by the amplifier circuit beyond the laminate structure.
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公开(公告)号:US20160190075A1
公开(公告)日:2016-06-30
申请号:US14613005
申请日:2015-02-03
Applicant: ANALOG DEVICES, INC.
Inventor: Andrew Pye , Rodrigo Carrillo-Ramirez
IPC: H01L23/66 , H01L23/00 , H01L23/495
CPC classification number: H01L23/66 , H01L23/4952 , H01L23/49541 , H01L23/49575 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2223/6611 , H01L2223/6638 , H01L2224/04042 , H01L2224/05014 , H01L2224/05554 , H01L2224/0603 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/48257 , H01L2224/48644 , H01L2224/48647 , H01L2224/49113 , H01L2224/49175 , H01L2924/00011 , H01L2924/00014 , H01L2924/1421 , H01L2924/14215 , H01L2224/45015 , H01L2924/207 , H01L2924/01005 , H01L2224/05599
Abstract: An integrated circuit can include a group of bond pads alternating between bond pads configured to provide a return path and bond pads configured to provide a signal bond pad. For example, five bond pads can be arranged in a return-signal-return-signal-return arrangement. The integrated circuit can further be configured to receive or transmit high frequency signals.
Abstract translation: 集成电路可以包括在配置成提供返回路径的接合焊盘和被配置为提供信号接合焊盘的接合焊盘之间交替的一组接合焊盘。 例如,可以以返回信号返回信号返回装置布置五个接合焊盘。 集成电路还可以被配置为接收或发送高频信号。
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