Invention Grant
- Patent Title: Laminated punched sheet metal electronic enclosure/shield with integrated gaskets
- Patent Title (中): 层压打孔钣金电子外壳/带集成垫圈的屏蔽
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Application No.: US14286233Application Date: 2014-05-23
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Publication No.: US09439307B2Publication Date: 2016-09-06
- Inventor: M. David Swafford , Marcus K. Da Silva , Steve U. Reinhold
- Applicant: Tektronix, Inc.
- Applicant Address: US OR Beaverton
- Assignee: TEKTRONIX, INC.
- Current Assignee: TEKTRONIX, INC.
- Current Assignee Address: US OR Beaverton
- Agency: Marger Johnson
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K5/02 ; H05K5/04
Abstract:
An assembly suitable for housing electronic components can include a top shield and a bottom shield, the bottom shield having a conductive outer cover, a wall section, and a laminating portion between the conductive outer cover and the wall section. The laminating portion may include laminating material. A printed circuit board (PCB) may be positioned between the top shield and the bottom shield.
Public/Granted literature
- US20150223357A1 LAMINATED PUNCHED SHEET METAL ELECTRONIC ENCLOSURE/SHIELD WITH INTEGRATED GASKETS Public/Granted day:2015-08-06
Information query
