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1.发明授权Laminated punched sheet metal electronic enclosure/shield with integrated gaskets 有权层压打孔钣金电子外壳/带集成垫圈的屏蔽公开(公告)号：US09439307B2
公开(公告)日：2016-09-06
申请号：US14286233
申请日：2014-05-23
Applicant: Tektronix, Inc.
Inventor： M. David Swafford , Marcus K. Da Silva , Steve U. Reinhold
CPC classification number: H05K5/0217 , H05K5/04 , H05K9/0033 , H05K9/0037
Abstract: An assembly suitable for housing electronic components can include a top shield and a bottom shield, the bottom shield having a conductive outer cover, a wall section, and a laminating portion between the conductive outer cover and the wall section. The laminating portion may include laminating material. A printed circuit board (PCB) may be positioned between the top shield and the bottom shield.
Abstract translation: 适于容纳电子部件的组件可以包括顶部屏蔽和底部屏蔽，底部屏蔽件具有导电外盖，壁部分和导电外盖与壁部之间的层压部分。 层压部分可以包括层压材料。 印刷电路板（PCB）可以位于顶部屏蔽和底部屏蔽之间。
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2.发明申请LAMINATED PUNCHED SHEET METAL ELECTRONIC ENCLOSURE/SHIELD WITH INTEGRATED GASKETS 有权层压打孔板金属电子外壳/带集成垫圈的屏蔽公开(公告)号：US20150223357A1
公开(公告)日：2015-08-06
申请号：US14286233
申请日：2014-05-23
Applicant: Tektronix, Inc.
Inventor： M. David Swafford , Marcus K. Da Silva , Steve U. Reinhold
CPC classification number: H05K5/0217 , H05K5/04 , H05K9/0033 , H05K9/0037
Abstract: An assembly suitable for housing electronic components can include a top shield and a bottom shield, the bottom shield having a conductive outer cover, a wall section, and a laminating portion between the conductive outer cover and the wall section. The laminating portion may include laminating material. A printed circuit board (PCB) may be positioned between the top shield and the bottom shield.
Abstract translation: 适于容纳电子部件的组件可以包括顶部屏蔽和底部屏蔽，底部屏蔽件具有导电外盖，壁部分和导电外盖与壁部之间的层压部分。 层压部分可以包括层压材料。 印刷电路板（PCB）可以位于顶部屏蔽和底部屏蔽之间。
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