公开(公告)号：USD1038798S1

公开(公告)日：2024-08-13

申请号：US29903042

申请日：2023-09-19

Applicant: Tektronix, Inc.

Designer： Chris A. Valentine ,  Neil Clayton ,  David M. Ediger ,  Marc A. Gessford ,  Taylor S. K. Heen ,  Brian A. Hollenberg ,  Steve U. Reinhold ,  Prashanth Thota ,  Satya N. Whitlock

Abstract: FIG. 1 is a top, front, right, isometric view of a test and measurement instrument with stand and battery showing the new design in a first operating position;
FIG. 2 is a top, rear, left isometric view thereof;
FIG. 3 is a front elevational view thereof
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a rear elevational view thereof;
FIG. 9 is a top, front, right, isometric view of a test and measurement instrument with stand and battery showing the new design a second operating position;
FIG. 10 is a top, rear, left isometric view thereof;
FIG. 11 is a front elevational view thereof
FIG. 12 is a left side elevational view thereof;
FIG. 13 is a right side elevational view thereof;
FIG. 14 is a top plan view thereof;
FIG. 15 is a bottom plan view thereof; and,
FIG. 16 is a rear elevational view thereof.
The broken lines in the drawings depict environmental structure as well as unclaimed portions of the test and measurement instrument with stand and battery, neither of which form any part of the claimed design.

公开(公告)号：USD1003181S1

公开(公告)日：2023-10-31

申请号：US29809745

申请日：2021-09-29

Applicant: Tektronix, Inc.

Designer： Chris A. Valentine ,  Neil Clayton ,  David M. Ediger ,  Marc A. Gessford ,  Taylor S. K. Heen ,  Brian A. Hollenberg ,  Steve U. Reinhold ,  Prashanth Thota ,  Satya N. Whitlock

Abstract: FIG. 1 is a top, front, right, isometric view of a test and measurement instrument showing the new design;
FIG. 2 is a top, rear, left isometric view thereof;
FIG. 3 is a front elevational view thereof
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a rear elevational view thereof;
FIG. 9 is a top, front, right, isometric view of another embodiment of a test and measurement instrument showing the new design;
FIG. 10 is a top, rear, left isometric view thereof;
FIG. 11 is a front elevational view thereof
FIG. 12 is a left side elevational view thereof;
FIG. 13 is a right side elevational view thereof;
FIG. 14 is a top plan view thereof;
FIG. 15 is a bottom plan view thereof; and,
FIG. 16 is a rear elevational view thereof.
The broken lines in the drawings depict environmental structure as well as unclaimed portions of the test and measurement instrument and accessories, neither of which form any part of the claimed design.

公开(公告)号：US20230077447A1

公开(公告)日：2023-03-16

申请号：US17944924

申请日：2022-09-14

Applicant: Tektronix, Inc.

Inventor： Chris A. Valentine ,  Prashanth Thota ,  Steve U. Reinhold ,  Jonathan D. Clem ,  Timothy Keil

IPC: G01R13/02 ,  G01R31/3835

Abstract: A test system includes a test and measurement instrument having one or more inputs for receiving one or more signals to be measured or tested, a display for outputting measurement results or test results, one or more processors for operating the instrument, a chassis housing the instrument, a power connection to receive power for powering the one or more processors from a wall connection. The test system further includes an external battery pack separate from the test and measurement instrument and structured to mechanically and electrically couple to and decouple from the test and measurement instrument, the external battery pack including a DC power source for powering the one or more processors. The test and measurement instrument includes no batteries or other power storage device for powering the one or more processors within the chassis of the instrument.

公开(公告)号：USD1038797S1

公开(公告)日：2024-08-13

申请号：US29903039

申请日：2023-09-19

Applicant: Tektronix, Inc.

Designer： Chris A. Valentine ,  Neil Clayton ,  David M. Ediger ,  Marc A. Gessford ,  Taylor S. K. Heen ,  Brian A. Hollenberg ,  Steve U. Reinhold ,  Prashanth Thota ,  Satya N. Whitlock

Abstract: FIG. 1 is a top, rear, left, isometric view of a battery accessory for a test and measurement instrument showing the new design in conjunction with a typical operating environment;
FIG. 2 is a top, front, right isometric view thereof;
FIG. 3 is a rear elevational view thereof,
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof and,
FIG. 7 is a bottom plan view thereof.
The broken lines in the drawings depict environmental structure as well as unclaimed portions of the battery accessory for a test and measurement instrument, neither of which form any part of the claimed design.

公开(公告)号：US09439307B2

公开(公告)日：2016-09-06

申请号：US14286233

申请日：2014-05-23

Applicant: Tektronix, Inc.

Inventor： M. David Swafford ,  Marcus K. Da Silva ,  Steve U. Reinhold

IPC: H05K9/00 ,  H05K5/02 ,  H05K5/04

CPC classification number: H05K5/0217 ,  H05K5/04 ,  H05K9/0033 ,  H05K9/0037

Abstract: An assembly suitable for housing electronic components can include a top shield and a bottom shield, the bottom shield having a conductive outer cover, a wall section, and a laminating portion between the conductive outer cover and the wall section. The laminating portion may include laminating material. A printed circuit board (PCB) may be positioned between the top shield and the bottom shield.

Abstract translation: 适于容纳电子部件的组件可以包括顶部屏蔽和底部屏蔽，底部屏蔽件具有导电外盖，壁部分和导电外盖与壁部之间的层压部分。 层压部分可以包括层压材料。 印刷电路板（PCB）可以位于顶部屏蔽和底部屏蔽之间。

公开(公告)号：US20150223357A1

公开(公告)日：2015-08-06

申请号：US14286233

申请日：2014-05-23

Applicant: Tektronix, Inc.

Inventor： M. David Swafford ,  Marcus K. Da Silva ,  Steve U. Reinhold

IPC: H05K5/02 ,  H05K5/04

CPC classification number: H05K5/0217 ,  H05K5/04 ,  H05K9/0033 ,  H05K9/0037

Abstract: An assembly suitable for housing electronic components can include a top shield and a bottom shield, the bottom shield having a conductive outer cover, a wall section, and a laminating portion between the conductive outer cover and the wall section. The laminating portion may include laminating material. A printed circuit board (PCB) may be positioned between the top shield and the bottom shield.

Abstract translation: 适于容纳电子部件的组件可以包括顶部屏蔽和底部屏蔽，底部屏蔽件具有导电外盖，壁部分和导电外盖与壁部之间的层压部分。 层压部分可以包括层压材料。 印刷电路板（PCB）可以位于顶部屏蔽和底部屏蔽之间。