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US09443734B2 Semiconductor memory devices and manufacturing methods thereof 有权
半导体存储器件及其制造方法

Semiconductor memory devices and manufacturing methods thereof
Abstract:
A semiconductor memory device and a manufacturing method of the semiconductor memory device are provided. The semiconductor memory device can include a substrate in which a cell area and a peripheral area are defined, a first gate insulating layer on the peripheral area, and a poly gate layer on the first gate insulating layer to form a combined stack, wherein the combined stack of the first gate insulating layer and the first poly gate layer is absent from the cell area.
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