Invention Grant
- Patent Title: Semiconductor memory devices and manufacturing methods thereof
- Patent Title (中): 半导体存储器件及其制造方法
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Application No.: US14574907Application Date: 2014-12-18
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Publication No.: US09443734B2Publication Date: 2016-09-13
- Inventor: Ki-Seok Lee , Jung-Hwan Park , Hyo-Jin Park , Kyu-Hyun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley, P.A.
- Priority: KR10-2013-0161502 20131223
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L29/423 ; H01L27/108

Abstract:
A semiconductor memory device and a manufacturing method of the semiconductor memory device are provided. The semiconductor memory device can include a substrate in which a cell area and a peripheral area are defined, a first gate insulating layer on the peripheral area, and a poly gate layer on the first gate insulating layer to form a combined stack, wherein the combined stack of the first gate insulating layer and the first poly gate layer is absent from the cell area.
Public/Granted literature
- US20150179658A1 Semiconductor Memory Devices and Manufacturing Methods Thereof Public/Granted day:2015-06-25
Information query
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