Invention Grant
- Patent Title: Semiconductor device with epitaxial structures and method for fabricating the same
- Patent Title (中): 具有外延结构的半导体器件及其制造方法
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Application No.: US14924734Application Date: 2015-10-28
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Publication No.: US09443970B2Publication Date: 2016-09-13
- Inventor: Hsin-Ming Hou , Yu-Cheng Tung , Ji-Fu Kung , Wai-Yi Lien , Ming-Tsung Chen
- Applicant: UNITED MICROELECTRONICS CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORPORATION
- Current Assignee: UNITED MICROELECTRONICS CORPORATION
- Current Assignee Address: TW Hsinchu
- Agent Ding Yu Tan
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/336 ; H01L21/762 ; H01L29/66

Abstract:
A semiconductor device including a substrate, a plurality of isolation structures, at least a gate structure, a plurality of dummy gate structures and a plurality of epitaxial structures is provided. The substrate has an active area defined by the isolation structures disposed within the substrate. That is, the active area is defined between the isolation structures. The gate structure is disposed on the substrate and located within the active area. The dummy gate structures are disposed on the substrate and located out of the active area. The edge of each dummy gate structure is separated from the boundary of the active area with a distance smaller than 135 angstroms. The epitaxial structures are disposed within the active area and in a portion of the substrate on two sides of the gate structure. The invention also provided a method for fabricating semiconductor device.
Public/Granted literature
- US20160049506A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2016-02-18
Information query
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