Invention Grant
- Patent Title: In situ on the fly on-chip variation measurement
- Patent Title (中): 原位实时片上变化测量
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Application No.: US14134259Application Date: 2013-12-19
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Publication No.: US09448281B2Publication Date: 2016-09-20
- Inventor: Jinn-Yeh Chien , Yung-Chow Peng , Chung-Chieh Yang , Kuan-Yu Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R31/317

Abstract:
A methodology and circuits for integrated circuit design are provided. A first electronic design file for an integrated circuit is provided. The first electronic design file for the integrated circuit has a timing measurement circuit thereon. Based on the first electronic design file, a number of integrated circuits are manufactured. These manufactured integrated circuits have respective timing measurement circuits arranged at predetermined locations thereon. The timing measurement circuits are used to measure a number of respective timing delay values, which are subject to manufacturing variation, on the integrated circuits. The measured timing delay values are used to set how an auto-place and route tool arranges blocks in a second electronic design file, which is routed after the timing delay values are measured, to account for any measured manufacturing variation.
Public/Granted literature
- US20150177327A1 In Situ on the Fly On-Chip Variation Measurement Public/Granted day:2015-06-25
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