发明授权
US09451695B2 Epoxy resin compound and radiant heat circuit board using the same
有权
环氧树脂复合物和使用其的辐射热电路板
- 专利标题： Epoxy resin compound and radiant heat circuit board using the same
- 专利标题（中）： 环氧树脂复合物和使用其的辐射热电路板
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申请号： US14119122申请日： 2012-05-21
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公开(公告)号： US09451695B2公开(公告)日： 2016-09-20
- 发明人: Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
- 申请人： Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
- 申请人地址： KR Seoul
- 专利权人： LG INNOTEK CO., LTD.
- 当前专利权人： LG INNOTEK CO., LTD.
- 当前专利权人地址： KR Seoul
- 代理机构： Saliwanchik Lloyd & Eisenschenk
- 优先权： KR10-2011-0048109 20110520
- 国际申请： PCT/KR2012/003991 WO 20120521
- 国际公布： WO2012/161490 WO 20121129
- 主分类号： C08L63/00
- IPC分类号： C08L63/00 ; C08K3/10 ; C08K3/22 ; C08K3/36 ; C08K3/38 ; H05K1/05 ; C08G59/62 ; C08G59/68 ; C09K5/14 ; C08K3/28 ; C08K3/00
摘要：
An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
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