Invention Grant
US09455259B2 Semiconductor devices including diffusion barriers with high electronegativity metals
有权
包括具有高电负性金属的扩散阻挡层的半导体器件
- Patent Title: Semiconductor devices including diffusion barriers with high electronegativity metals
- Patent Title (中): 包括具有高电负性金属的扩散阻挡层的半导体器件
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Application No.: US14716371Application Date: 2015-05-19
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Publication No.: US09455259B2Publication Date: 2016-09-27
- Inventor: Han-Jin Lim , Youn-Soo Kim , Hyun Park , Soon-Gun Lee , Eun-Ae Cho , Chin-Moo Cho , Sung-Jin Kim , Seok-Woo Nam
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley, P.A.
- Priority: KR10-2014-0122857 20140916
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L49/02

Abstract:
A semiconductor device includes a capacitor with reduced oxygen defects at an interface between a dielectric layer and an electrode of the capacitor. The semiconductor device includes a lower metal layer; a dielectric layer on the lower metal layer and containing a first metal; a sacrificial layer on the dielectric layer and containing a second metal; and an upper metal layer on the sacrificial layer. An electronegativity of the second metal in the sacrificial layer is greater than an electronegativity of the first metal in the dielectric layer.
Public/Granted literature
- US20160079247A1 Semiconductor Device Public/Granted day:2016-03-17
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