SEMICONDUCTOR DEVICE HAVING CAPACITOR AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE

    公开(公告)号:US20170098652A1

    公开(公告)日:2017-04-06

    申请号:US15229424

    申请日:2016-08-05

    Abstract: A semiconductor device having a capacitor includes a substrate which has a transistor, a first insulating pattern which is formed on the substrate and does not overlap a first contact node formed in the substrate, a second insulating pattern which is formed on the substrate, does not overlap a second contact node formed in the substrate, and is separated from the first insulating pattern, a first lower electrode which is formed on part of the substrate and sidewalls of the first insulating pattern, a second lower electrode which is formed on part of the substrate and sidewalls of the second insulating pattern, a dielectric layer pattern which is formed on the first lower electrode and the second lower electrode, and an upper electrode which is formed on the dielectric layer pattern. Related fabrication methods are also discussed.

    Semiconductor device having capacitor and method of fabricating the semiconductor device

    公开(公告)号:US09716094B2

    公开(公告)日:2017-07-25

    申请号:US15229424

    申请日:2016-08-05

    Abstract: A semiconductor device having a capacitor includes a substrate which has a transistor, a first insulating pattern which is formed on the substrate and does not overlap a first contact node formed in the substrate, a second insulating pattern which is formed on the substrate, does not overlap a second contact node formed in the substrate, and is separated from the first insulating pattern, a first lower electrode which is formed on part of the substrate and sidewalls of the first insulating pattern, a second lower electrode which is formed on part of the substrate and sidewalls of the second insulating pattern, a dielectric layer pattern which is formed on the first lower electrode and the second lower electrode, and an upper electrode which is formed on the dielectric layer pattern. Related fabrication methods are also discussed.

    Semiconductor devices including diffusion barriers with high electronegativity metals
    7.
    发明授权
    Semiconductor devices including diffusion barriers with high electronegativity metals 有权
    包括具有高电负性金属的扩散阻挡层的半导体器件

    公开(公告)号:US09455259B2

    公开(公告)日:2016-09-27

    申请号:US14716371

    申请日:2015-05-19

    CPC classification number: H01L27/10814 H01L28/75 H01L28/91

    Abstract: A semiconductor device includes a capacitor with reduced oxygen defects at an interface between a dielectric layer and an electrode of the capacitor. The semiconductor device includes a lower metal layer; a dielectric layer on the lower metal layer and containing a first metal; a sacrificial layer on the dielectric layer and containing a second metal; and an upper metal layer on the sacrificial layer. An electronegativity of the second metal in the sacrificial layer is greater than an electronegativity of the first metal in the dielectric layer.

    Abstract translation: 半导体器件包括在电介质层和电容器的电极之间的界面处具有减少的氧缺陷的电容器。 半导体器件包括下金属层; 在下金属层上的介电层并含有第一金属; 在介电层上的牺牲层并含有第二金属; 和牺牲层上的上金属层。 牺牲层中的第二金属的电负性大于电介质层中第一金属的电负性。

    Semiconductor Device
    8.
    发明申请
    Semiconductor Device 有权
    半导体器件

    公开(公告)号:US20160079247A1

    公开(公告)日:2016-03-17

    申请号:US14716371

    申请日:2015-05-19

    CPC classification number: H01L27/10814 H01L28/75 H01L28/91

    Abstract: A semiconductor device includes a capacitor with reduced oxygen defects at an interface between a dielectric layer and an electrode of the capacitor. The semiconductor device includes a lower metal layer; a dielectric layer on the lower metal layer and containing a first metal; a sacrificial layer on the dielectric layer and containing a second metal; and an upper metal layer on the sacrificial layer. An electronegativity of the second metal in the sacrificial layer is greater than an electronegativity of the first metal in the dielectric layer.

    Abstract translation: 半导体器件包括在电介质层和电容器的电极之间的界面处具有减少的氧缺陷的电容器。 半导体器件包括下金属层; 在下金属层上的介电层并含有第一金属; 在介电层上的牺牲层并含有第二金属; 和牺牲层上的上金属层。 牺牲层中的第二金属的电负性大于电介质层中第一金属的电负性。

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