Invention Grant
- Patent Title: Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition
- Patent Title (中): 铜金属膜,其制造方法,铜金属图案,使用铜金属图案的导电布线,铜金属凸块,导热路径,接合材料和液体组成
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Application No.: US13496550Application Date: 2010-09-13
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Publication No.: US09457406B2Publication Date: 2016-10-04
- Inventor: Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Shunya Yokosawa , Katsuyuki Masuda , Yoshinori Ejiri , Maki Inada , Kyoko Kuroda
- Applicant: Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Shunya Yokosawa , Katsuyuki Masuda , Yoshinori Ejiri , Maki Inada , Kyoko Kuroda
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: JPP2009-215003 20090916
- International Application: PCT/JP2010/065698 WO 20100913
- International Announcement: WO2011/034016 WO 20110324
- Main IPC: B22F3/24
- IPC: B22F3/24 ; B22F9/26 ; B32B15/01 ; C22C5/04 ; C22C9/00 ; H01B1/02 ; H05K3/12 ; B22F9/22 ; B22F1/02 ; H05K1/09 ; H05K3/10

Abstract:
Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120° C. or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.
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