公开(公告)号：US09457406B2

公开(公告)日：2016-10-04

申请号：US13496550

申请日：2010-09-13

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Katsuyuki Masuda ,  Yoshinori Ejiri ,  Maki Inada ,  Kyoko Kuroda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Katsuyuki Masuda ,  Yoshinori Ejiri ,  Maki Inada ,  Kyoko Kuroda

IPC分类号： B22F3/24 ,  B22F9/26 ,  B32B15/01 ,  C22C5/04 ,  C22C9/00 ,  H01B1/02 ,  H05K3/12 ,  B22F9/22 ,  B22F1/02 ,  H05K1/09 ,  H05K3/10

CPC分类号： B22F9/26 ,  B22F1/02 ,  B22F9/22 ,  B22F9/24 ,  B22F2201/01 ,  B22F2301/10 ,  B22F2302/25 ,  B22F2999/00 ,  B32B15/01 ,  C22C5/04 ,  C22C9/00 ,  H01B1/026 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0224 ,  H05K2201/0272 ,  H05K2203/0315 ,  H05K2203/1131 ,  H05K2203/1157 ,  Y10T156/10 ,  Y10T428/12903 ,  B22F2201/013 ,  B22F2202/13

摘要： Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120° C. or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.

摘要翻译： 公开了一种对基板具有良好粘合性的铜金属膜，体积电阻率小，以及良好的深部金属性质; 以及铜金属膜的制造方法，其中可以通过将基板还原到其深部而不损坏基板来制造铜金属膜。 具体公开了通过将含有氧化铜和金属过渡金属或合金的铜基颗粒沉积层或含有金属元素的过渡金属络合物与加热至120℃的气态甲酸和/或甲醛处理而获得的铜金属膜 ℃以上。 氧化铜优选为氧化铜（I）和/或氧化铜（II）。 过渡金属，合金或金属络合物优选为分别选自Cu，Pd，Pt，Ni，Ag，Au和Rh的金属，含金属的合金或含金属元素的复合物。

公开(公告)号：US20120175147A1

公开(公告)日：2012-07-12

申请号：US13496550

申请日：2010-09-13

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Katsuyuki Masuda ,  Yoshinori Ejiri ,  Maki Inada ,  Kyoko Kuroda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Katsuyuki Masuda ,  Yoshinori Ejiri ,  Maki Inada ,  Kyoko Kuroda

IPC分类号： H01B5/00 ,  B05D3/10 ,  B05D1/12 ,  C09D11/02 ,  B32B37/00 ,  B32B15/01 ,  B32B15/00 ,  B05D3/00 ,  B05D3/06

CPC分类号： B22F9/26 ,  B22F1/02 ,  B22F9/22 ,  B22F9/24 ,  B22F2201/01 ,  B22F2301/10 ,  B22F2302/25 ,  B22F2999/00 ,  B32B15/01 ,  C22C5/04 ,  C22C9/00 ,  H01B1/026 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0224 ,  H05K2201/0272 ,  H05K2203/0315 ,  H05K2203/1131 ,  H05K2203/1157 ,  Y10T156/10 ,  Y10T428/12903 ,  B22F2201/013 ,  B22F2202/13

摘要： Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120° C. or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.

摘要翻译： 公开了一种对基板具有良好粘合性的铜金属膜，体积电阻率小，以及良好的深部金属性质; 以及铜金属膜的制造方法，其中可以通过将基板还原到其深部而不损坏基板来制造铜金属膜。 具体公开了通过将含有氧化铜和金属过渡金属或合金的铜基颗粒沉积层或含有金属元素的过渡金属络合物与加热至120℃的气态甲酸和/或甲醛处理而获得的铜金属膜 ℃以上。 氧化铜优选为氧化铜（I）和/或氧化铜（II）。 过渡金属，合金或金属络合物优选为分别选自Cu，Pd，Pt，Ni，Ag，Au和Rh的金属，含金属的合金或含金属元素的复合物。

公开(公告)号：US20120170241A1

公开(公告)日：2012-07-05

申请号：US13496528

申请日：2010-09-13

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda ,  Kyoko Kuroda ,  Maki Inada

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda ,  Kyoko Kuroda ,  Maki Inada

IPC分类号： H05K7/02 ,  C09D11/02 ,  B82Y30/00

CPC分类号： C09D11/52 ,  C09D11/322 ,  H05K1/097

摘要： Disclosed is a printing ink comprising Cu- and/or CuO-containing metal nanoparticles, which obtains excellent dispersion properties and successive dispersion stability without using additives such as dispersing agents. Specifically disclosed is a printing ink that comprises Cu- and/or CuO-containing metal nanoparticles and has no more than 2,600 ppm of ionic impurities in the total solid content. The printing ink is obtained by dispersing the Cu- and/or CuO-containing metal nanoparticles, which have no more than 2,600 ppm of ionic impurities in the total solid content, in a dispersion medium.

摘要翻译： 公开了一种包含含有Cu和/或CuO的金属纳米颗粒的印刷油墨，其不需使用分散剂等添加剂，可获得优异的分散性和连续的分散稳定性。 具体公开了一种包含含Cu和/或CuO的金属纳米颗粒并且在总固体含量中不超过2600ppm的离子杂质的印刷油墨。 印刷油墨是通过在分散介质中分散具有不超过2600ppm的总固体含量的离子杂质的含Cu和/或CuO的金属纳米颗粒而获得的。

公开(公告)号：US20140242362A1

公开(公告)日：2014-08-28

申请号：US14236343

申请日：2012-07-30

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Takaaki Noudou ,  Maki Inada ,  Kyoko Kuroda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Takaaki Noudou ,  Maki Inada ,  Kyoko Kuroda

IPC分类号： C09J9/02 ,  H01B13/00 ,  C09J11/04

CPC分类号： C09J9/02 ,  B05D5/12 ,  C08K3/08 ,  C08K3/22 ,  C08K7/18 ,  C09J7/28 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01B1/22 ,  H01B13/00 ,  H05K1/0306 ,  H05K1/095 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1208 ,  H05K3/1283 ,  H05K3/38 ,  H05K2203/1157 ,  Y10T428/24967 ,  Y10T428/25

摘要： The invention provides a composition set comprising: a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 3000 nm.

摘要翻译： 本发明提供一种组合物组合物，其包含：导体层形成组合物，其包含分散介质和包含金属氧化物的无机颗粒; 以及包含粘合剂和数均粒径为1nm〜3000nm的导电性粒子的导电性粘合剂组合物。

公开(公告)号：US09676969B2

公开(公告)日：2017-06-13

申请号：US14236343

申请日：2012-07-30

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Takaaki Noudou ,  Maki Inada ,  Kyoko Kuroda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Takaaki Noudou ,  Maki Inada ,  Kyoko Kuroda

IPC分类号： H01B1/00 ,  B05D5/12 ,  C09J9/00 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K3/38 ,  C09J7/02 ,  H01B13/00 ,  H05K3/10 ,  H05K1/09 ,  H05K3/12 ,  H05K1/03 ,  C08K3/08 ,  C08K3/22 ,  C08K7/18

CPC分类号： C09J9/02 ,  B05D5/12 ,  C08K3/08 ,  C08K3/22 ,  C08K7/18 ,  C09J7/28 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01B1/22 ,  H01B13/00 ,  H05K1/0306 ,  H05K1/095 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1208 ,  H05K3/1283 ,  H05K3/38 ,  H05K2203/1157 ,  Y10T428/24967 ,  Y10T428/25

摘要： The invention provides a composition set comprising: a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 3000 nm.

公开(公告)号：US20100233011A1

公开(公告)日：2010-09-16

申请号：US12739228

申请日：2008-10-20

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Youichi Machii ,  Yasushi Kumashiro ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Youichi Machii ,  Yasushi Kumashiro ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

IPC分类号： B22F7/04 ,  B22F1/02 ,  B32B15/02

CPC分类号： H05K3/102 ,  H01B1/026 ,  H01B1/22 ,  H01L21/4867 ,  H01L23/49866 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/105 ,  H05K2203/0315 ,  H05K2203/1131 ,  H05K2203/1157 ,  Y10T428/12181 ,  H01L2924/00

摘要： There are provided are a method wherein a surface treating agent, which is essential for making copper particles antioxidative and dispersing the copper particles in the prior art, is hardly used but copper particles, which cause little electromigration and are small in the price rate of material itself, are used to form a low-resistance copper wiring pattern while the generation of cracks therein is restrained; and a copper oxide particle dispersed slurry used therein.The method is a method for forming a copper wiring pattern including the step of using a dispersion slurry wherein copper based particles having a copper oxide surface are dispersed to form any pattern over a substrate, and the step of reducing the copper oxide surface of the copper based particles in the pattern with atomic form hydrogen to return the oxide to copper, and sintering particles of the copper metal generated by the reduction and bonding the particles to each other.

摘要翻译： 提供了一种方法，其中对现有技术中的铜颗粒进行抗氧化和分散是必需的表面处理剂几乎不被使用，但是导致电迁移少的材料和材料的价格率小的铜颗粒 本身用于形成低电阻铜布线图案，同时抑制其中的裂纹的产生; 和其中使用的氧化铜颗粒分散浆料。 该方法是一种形成铜布线图案的方法，包括使用其中分散有铜氧化物表面的铜基颗粒在基底上形成任何图案的分散浆料的步骤，以及还原铜的氧化铜表面的步骤 以原子形式形成氢以将氧化物返回到铜，以及烧结通过还原并将颗粒彼此结合而产生的铜金属的颗粒。

公开(公告)号：US08801971B2

公开(公告)日：2014-08-12

申请号：US12808768

申请日：2008-12-17

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Youichi Machii ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Youichi Machii ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

IPC分类号： H01B1/00 ,  H01B1/12 ,  C22C9/00 ,  C21B11/10 ,  B05D5/12 ,  B28B19/00 ,  B29B15/00 ,  C23C18/00 ,  C23C20/00 ,  C23C24/00 ,  C23C26/00 ,  C23C28/00 ,  C23C30/00 ,  H01C17/06 ,  H05K3/00 ,  B22F3/00 ,  B22F3/26 ,  B22F5/00 ,  B22F7/00 ,  C22C28/00 ,  C22C29/00 ,  B32B15/20

CPC分类号： H05K3/182 ,  C23C18/1601 ,  C23C18/1603 ,  C23C18/1633 ,  C23C18/1635 ,  C23C18/1637 ,  C23C18/1824 ,  C23C18/1872 ,  C23C18/30 ,  C23C18/40 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29347 ,  H01L2224/8384 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19043 ,  H01L2924/203 ,  H05K3/105 ,  H05K3/1241 ,  H05K2203/0315 ,  H05K2203/0709 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10T428/12014 ,  Y10T428/12903 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/0002

摘要： Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.

摘要翻译： 提供一种铜导体膜及其制造方法，并且具有优良的导电性和布线图案形成的图案化的铜导体布线，即使在窄的布线宽度和窄的布线间距下也不会降低电路之间的绝缘。 公开了一种铜导体膜及其制造方法，其中含有对还原剂具有催化活性的金属和含有氧化铜的两者的铜基颗粒含有层使用含有电离的试剂的处理溶液或 复合铜氧化物和还原剂，其在单一溶液中还原铜离子或铜络合物以形成金属铜，以及通过使用印刷图案化含铜基颗粒的层和通过所述图案化的含有颗粒的图案形成的图案化的铜导体布线 层通过使用包含电离或复合氧化铜的试剂和还原剂的溶液进行处理，所述试剂在单一溶液中还原铜离子或铜络合物以形成金属铜。

公开(公告)号：US20120125659A1

公开(公告)日：2012-05-24

申请号：US12808768

申请日：2008-12-17

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Youichi Machii ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Youichi Machii ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

IPC分类号： H01B5/00 ,  C22B15/00 ,  C09K3/00 ,  B05D3/00 ,  B32B15/20 ,  C22C9/00 ,  B05D5/12

CPC分类号： H05K3/182 ,  C23C18/1601 ,  C23C18/1603 ,  C23C18/1633 ,  C23C18/1635 ,  C23C18/1637 ,  C23C18/1824 ,  C23C18/1872 ,  C23C18/30 ,  C23C18/40 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29347 ,  H01L2224/8384 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19043 ,  H01L2924/203 ,  H05K3/105 ,  H05K3/1241 ,  H05K2203/0315 ,  H05K2203/0709 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10T428/12014 ,  Y10T428/12903 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/0002

摘要： Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.

摘要翻译： 提供一种铜导体膜及其制造方法，并且具有优良的导电性和布线图案形成的图案化的铜导体布线，即使在窄的布线宽度和窄的布线间距下也不会降低电路之间的绝缘。 公开了一种铜导体膜及其制造方法，其中含有对还原剂具有催化活性的金属和含有氧化铜的两者的铜基颗粒含有层使用含有电离的试剂的处理溶液或 复合铜氧化物和还原剂，其在单一溶液中还原铜离子或铜络合物以形成金属铜，以及通过使用印刷图案化含铜基颗粒的层和通过所述图案化的含有颗粒的图案形成的图案化的铜导体布线 层通过使用包含电离或复合氧化铜的试剂和还原剂的溶液进行处理，所述试剂在单一溶液中还原铜离子或铜络合物以形成金属铜。

公开(公告)号：US20090134386A1

公开(公告)日：2009-05-28

申请号：US12195560

申请日：2008-08-21

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Masahiko Ando ,  Takeo Shiba

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Masahiko Ando ,  Takeo Shiba

IPC分类号： H01L51/05 ,  H01L51/40

CPC分类号： H01L51/052 ,  H01L51/0043 ,  H01L51/0545

摘要： An organic field-effect transistor has a gate insulating layer comprising a cured epoxy resin. The epoxy resin has a lower concentration of trapping centres compared with a conventional epoxy resin in which trapping centres are provided by hydroxyl (OH) groups. The lower concentration of trapping centres can be achieved by reducing the number of hydroxyl groups throughout the layer and/or by reducing the number of hydroxyl groups in a surface region.

摘要翻译： 有机场效应晶体管具有包含固化的环氧树脂的栅极绝缘层。 与其中由羟基（OH）基团提供捕集中心的常规环氧树脂相比，环氧树脂具有较低的捕集中心浓度。 通过减少整个层中的羟基数量和/或通过减少表面区域中的羟基数可以实现较低浓度的捕获中心。

公开(公告)号：US09228100B2

公开(公告)日：2016-01-05

申请号：US13814293

申请日：2011-08-04

申请人： Yasushi Kumashiro ,  Naoki Maruyama ,  Maki Inada

发明人： Yasushi Kumashiro ,  Naoki Maruyama ,  Maki Inada

IPC分类号： H01B1/06 ,  H01B1/24 ,  C09D11/324 ,  C08K3/04 ,  C08K7/24 ,  H01C7/00 ,  H01C17/065 ,  C09D11/52 ,  H05K1/16 ,  C08K5/1535 ,  C09D11/36 ,  C09D11/38 ,  C09D163/00 ,  C08L63/00 ,  B82Y99/00

CPC分类号： C09D11/324 ,  B82Y99/00 ,  C08K3/04 ,  C08K3/041 ,  C08K3/045 ,  C08K5/1535 ,  C08K7/24 ,  C08K2201/005 ,  C08K2201/011 ,  C08L63/00 ,  C09D11/36 ,  C09D11/38 ,  C09D11/52 ,  C09D163/00 ,  H01B1/24 ,  H01C7/003 ,  H01C17/0652 ,  H01C17/06593 ,  H05K1/167 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10S977/742

摘要： There is provided a liquid composition that can form a resistor exhibiting a stable resistance value. One mode of the liquid composition of the invention is a liquid composition comprising (a) an epoxy resin, (b) carbon black particles, (c) carbon nanotubes and (d) a solvent with a vapor pressure of less than 1.34×103 Pa at 25° C.

摘要翻译： 提供了可以形成具有稳定电阻值的电阻器的液体组合物。 本发明的液体组合物的一种模式是包含（a）环氧树脂，（b）炭黑颗粒，（c）碳纳米管和（d）蒸气压小于1.34×10 3 Pa的溶剂的液体组合物 在25°C