Invention Grant
- Patent Title: Optoelectronic packages having magnetic field cancelation
- Patent Title (中): 具有磁场消除的光电封装
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Application No.: US15042215Application Date: 2016-02-12
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Publication No.: US09461439B2Publication Date: 2016-10-04
- Inventor: Roozbeh Parsa , William French
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01S5/022 ; H01L25/16 ; H01L31/02 ; H01L31/0232 ; H01L31/024 ; H01L31/167 ; H01S5/024 ; H01S5/183

Abstract:
A stacked optoelectronic packaged device includes a bottom die having a top surface including bottom electrical traces and a light source die coupled to ≧1 bottom electrical traces. A first cavity die is on the bottom die. An optics die is on the first cavity die and a second cavity die on the optics die. A mounting substrate is on the second cavity die including top electrical traces. A photodetector die is optically coupled to receive light from the light source. The bottom and top electrical traces are both positioned substantially symmetrically on sides of a mirror plane so that when conducting equal and opposite currents a first magnetic field emanating from the first side and a second magnetic field emanating from the second side cancel one another to provide a reduction in magnetic flux density by more than 50% at one or more die locations on the optics die.
Public/Granted literature
- US20160164252A1 OPTOELECTRONIC PACKAGES HAVING MAGNETIC FIELD CANCELATION Public/Granted day:2016-06-09
Information query
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