Invention Grant
- Patent Title: Service processor patch mechanism
- Patent Title (中): 服务处理器补丁机制
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Application No.: US14281758Application Date: 2014-05-19
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Publication No.: US09471133B2Publication Date: 2016-10-18
- Inventor: G. Glenn Henry , Stephan Gaskins
- Applicant: VIA TECHNOLOGIES, INC.
- Applicant Address: TW New Taipei
- Assignee: VIA TECHNOLOGIES, INC.
- Current Assignee: VIA TECHNOLOGIES, INC.
- Current Assignee Address: TW New Taipei
- Agent E. Alan Davis; James W. Huffman
- Main IPC: G06F12/08
- IPC: G06F12/08 ; G06F1/32 ; G06F1/04 ; G06F1/12 ; G06F9/30 ; G06F9/38 ; G06F9/44 ; G06F13/24

Abstract:
A microprocessor includes a plurality of processing cores, a service processing unit and a memory accessible by both the service processing unit and the plurality of processing cores. At least one of the plurality of processing cores is configured to write a patch to the memory. The patch comprises one or more instructions to be fetched from the memory and executed by the service processing unit after written to the memory by the at least one of the plurality of processing cores.
Public/Granted literature
- US20150067263A1 SERVICE PROCESSOR PATCH MECHANISM Public/Granted day:2015-03-05
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