Invention Grant
- Patent Title: Coplanar integration of a direct-bandgap chip into a silicon photonic device
- Patent Title (中): 将直接带隙芯片共面整合到硅光子器件中
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Application No.: US14509971Application Date: 2014-10-08
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Publication No.: US09496431B2Publication Date: 2016-11-15
- Inventor: Stephen B. Krasulick , John Dallesasse , Amit Mizrahi , Timothy Creazzo , Elton Marchena , John Y. Spann
- Applicant: Skorpios Technologies, Inc.
- Applicant Address: US NM Albuquerque
- Assignee: Skorpios Technologies, Inc.
- Current Assignee: Skorpios Technologies, Inc.
- Current Assignee Address: US NM Albuquerque
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/0232 ; H01S5/022 ; H01S5/026 ; H01S5/30 ; H01S5/02
Abstract:
A method for fabricating a composite device comprises providing a platform, providing a chip, and bonding the chip to the platform. The platform has a base layer and a device layer above the base layer. An opening in the device layer exposes a portion of the base layer. The chip is bonded to the portion of the base layer exposed by the opening in the device layer. A portion of the chip extends above the platform and is removed.
Public/Granted literature
- US20150097210A1 COPLANAR INTEGRATION OF A DIRECT-BANDGAP CHIP INTO A SILICON PHOTONIC DEVICE Public/Granted day:2015-04-09
Information query
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