Invention Grant
- Patent Title: Package structure and method for fabricating the same
- Patent Title (中): 封装结构及其制造方法
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Application No.: US14463999Application Date: 2014-08-20
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Publication No.: US09508656B2Publication Date: 2016-11-29
- Inventor: Chih-Hsien Chiu , Hsin-Lung Chung , Cho-Hsin Chang , Chia-Yang Chen , Chao-Ya Yang
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW103125448A 20140725
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H05K3/30 ; H01L21/78 ; H01L23/31 ; H01L21/56 ; H01L23/00 ; H01L25/065
Abstract:
A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.
Public/Granted literature
- US20160027740A1 PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2016-01-28
Information query
IPC分类:
