Invention Grant
- Patent Title: Semiconductor memory incorporating insulating layers of progressively decreasing band gaps and method of manufacturing the same
- Patent Title (中): 包含逐渐减小的带隙的绝缘层的半导体存储器及其制造方法
-
Application No.: US14712903Application Date: 2015-05-14
-
Publication No.: US09514946B2Publication Date: 2016-12-06
- Inventor: Masao Inoue , Yoshiki Maruyama , Tomoya Saito , Atsushi Yoshitomi
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2014-112887 20140530
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/28 ; H01L29/51 ; H01L29/423 ; H01L29/66 ; H01L29/792

Abstract:
An improvement is achieved in the performance of a semiconductor device including a memory element. Over a semiconductor substrate, a gate electrode for the memory element is formed via an insulating film as a gate insulating film for the memory element. The insulating film includes first, second, third, fourth, and fifth insulating films in order of being apart from the substrate. The second insulating film has a charge storing function. The band gap of each of the first and third insulating films is larger than a band gap of the second insulating film. The band gap of the fourth insulating film is smaller than the band gap of the third insulating film. The band gap of the fifth insulating film is smaller than the band gap of the fourth insulating film.
Public/Granted literature
- US20150349143A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-12-03
Information query
IPC分类: