发明授权
US09521795B2 Two-step direct bonding processes and tools for performing the same
有权
两步直接粘接工艺和执行相同的工具
- 专利标题： Two-step direct bonding processes and tools for performing the same
- 专利标题（中）： 两步直接粘接工艺和执行相同的工具
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申请号： US13866858申请日： 2013-04-19
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公开(公告)号： US09521795B2公开(公告)日： 2016-12-13
- 发明人: Yi-Li Hsiao , Da-Yuan Shih , Chih-Hang Tung , Chen-Hua Yu
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： B23K31/00
- IPC分类号： B23K31/00 ; B23K31/02 ; H05K13/04 ; H01L23/00
摘要：
A method includes placing a plurality of first package components over second package components, which are included in a third package component. First metal connectors in the first package components are aligned to respective second metal connectors of the second package components. After the plurality of first package components is placed, a metal-to-metal bonding is performed to bond the first metal connectors to the second metal connectors.
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