Invention Grant
- Patent Title: Monolithically integrated system on chip for silicon photonics
- Patent Title (中): 用于硅光子学的单片集成系统芯片
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Application No.: US14311004Application Date: 2014-06-20
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Publication No.: US09547622B1Publication Date: 2017-01-17
- Inventor: Radhakrishnan L. Nagarajan , Chao Xu
- Applicant: INPHI CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INPHI CORPORATION
- Current Assignee: INPHI CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Ogawa P.C.
- Agent Richard T. Ogawa
- Main IPC: H04B10/80
- IPC: H04B10/80 ; H04B10/40 ; H04B10/556 ; H04B10/54 ; H04B10/516 ; H04B10/69 ; H04J14/02 ; G06F13/24 ; G06F13/42
Abstract:
In an example, the present invention includes an integrated system on chip device. The device is configured on a single silicon substrate member. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device.
Information query
