Invention Grant
- Patent Title: Method for patterning an underlying layer
- Patent Title (中): 图案化底层的方法
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Application No.: US15045923Application Date: 2016-02-17
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Publication No.: US09548208B2Publication Date: 2017-01-17
- Inventor: Boon Teik Chan , Zheng Tao , Nadia Vandenbroeck , Safak Sayan
- Applicant: IMEC VZW
- Applicant Address: BE Leuven
- Assignee: IMEC VZW
- Current Assignee: IMEC VZW
- Current Assignee Address: BE Leuven
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Priority: EP15157046 20150227
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/308 ; H01L21/033 ; H01L29/66

Abstract:
A method for patterning an underlying layer is described, the method comprising providing a guiding layer on the underlying layer, the guiding layer comprising guiding structures and being substantially planar; providing a block-copolymer layer on the guiding layer; inducing phase separation of the block-copolymer layer in a regular pattern of structures of a first and a second polymer component, whereby one of the components aligns to the guiding structures, by chemo-epitaxy; thereafter, removing a first of the components of the block-copolymer layers completely, leaving a regular pattern of structures of the second component; providing a planarizing layer over the regular pattern of structures of the second component and the guiding layer; removing a portion of the planarizing layer, thereby leaving a regular pattern of structures of the planarizing layer at positions in between the structures of the second component, and exposing the structures of the second component; removing the structures of the second component, selectively with respect to the structures of the planarizing layer; and patterning the underlying layer, thereby using the structures of the planarizing layer as a mask.
Public/Granted literature
- US20160254161A1 Method for Patterning an Underlying Layer Public/Granted day:2016-09-01
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