Invention Grant
- Patent Title: Electrical interconnect for an electronic package
- Patent Title (中): 电子封装的电气互连
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Application No.: US14555124Application Date: 2014-11-26
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Publication No.: US09552995B2Publication Date: 2017-01-24
- Inventor: Khang Choong Yong , Bok Eng Cheah , Teong Keat Beh , Howard L. Heck , Jackson Chung Peng Kong , Stephen H. Hall , Kooi Chi Ooi
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/288 ; H01L23/00 ; H01L21/768 ; H01L23/48

Abstract:
Some example forms relate to an electrical interconnect for an electronic package. The electrical interconnect includes a dielectric layer that includes a trench formed into one surface of the dielectric layer and a signal conductor that fills the trench and extends above the one surface of dielectric layer. The electrical interconnect further includes a conductive reference layer mounted on an opposing side of the dielectric layer. The conductive reference layer is electromagnetically coupled to the signal conductor when current passes through the signal conductor.
Public/Granted literature
- US20160148866A1 ELECTRICAL INTERCONNECT FOR AN ELECTRONIC PACKAGE Public/Granted day:2016-05-26
Information query
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