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公开(公告)号：US09606949B1
公开(公告)日：2017-03-28
申请号：US14864019
申请日：2015-09-24
申请人： INTEL CORPORATION
发明人： Khang Choong Yong , Khai Ern See , Amit Kumar Srivastava , Jackson Chung Peng Kong , Teong Keat Beh , Eng Huat Goh
CPC分类号： G06F13/385 , G06F3/0634 , G06F3/065 , G06F3/0673 , G06F11/1456 , G06F13/4022 , G06F13/4081 , G06F2201/84
摘要： A universal interconnection scheme enables system architecture modularization with a hot-pluggable external computing module, such as a PC-on-a-card device using USB type-C technology. With the flexibility to interchange the system computing module with an external module, system performance can be augmented to fulfill the essential needs of the user, whether the system is a portable low-power tablet device, a smartphone, a wearable device such as an Internet of Things device, or a high-performance PC.
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公开(公告)号：US20160216731A1
公开(公告)日：2016-07-28
申请号：US14604531
申请日：2015-01-23
申请人： Intel Corporation
发明人： Eng Huat Goh , Khai Ern See , Damien Weng Kong Chong , Min Suet Lim , Ping Ping Ooi , Chu Aun Lim , Jimmy Huat Since Huang , Poh Tat Oh , Teong Keat Beh , Jackson Chung Peng Kong , Fern Nee Tan , Jenn Chuan Cheng
CPC分类号： G06F1/163 , G06F1/16 , G06F1/1656 , G06F1/187 , G06F13/38 , H01L2224/16225 , H01L2224/48091 , H01L2224/73204 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Embodiments are generally directed to an apparatus utilizing computer on package construction. An embodiment of a computer includes a substrate; one or more semiconductor devices, the one or more semiconductor devices being direct chip attached to the substrate, the one or more semiconductor devices including a central processing unit (CPU); and one or more additional components installed on the substrate, wherein the computer excludes I/O components.
摘要翻译： 实施例一般涉及利用计算机在包装结构上的装置。 计算机的一个实施例包括基板; 一个或多个半导体器件，所述一个或多个半导体器件是直接芯片附着到所述衬底，所述一个或多个半导体器件包括中央处理单元（CPU）; 以及安装在基板上的一个或多个附加部件，其中计算机不包括I / O部件。
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公开(公告)号：US10317938B2
公开(公告)日：2019-06-11
申请号：US14604531
申请日：2015-01-23
申请人： Intel Corporation
发明人： Eng Huat Goh , Khai Ern See , Damien Weng Kong Chong , Min Suet Lim , Ping Ping Ooi , Chu Aun Lim , Jimmy Huat Since Huang , Poh Tat Oh , Teong Keat Beh , Jackson Chung Peng Kong , Fern Nee Tan , Jenn Chuan Cheng
摘要： Embodiments are generally directed to an apparatus utilizing computer on package construction. An embodiment of a computer includes a substrate; one or more semiconductor devices, the one or more semiconductor devices being direct chip attached to the substrate, the one or more semiconductor devices including a central processing unit (CPU); and one or more additional components installed on the substrate, wherein the computer excludes I/O components.
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公开(公告)号：US09552995B2
公开(公告)日：2017-01-24
申请号：US14555124
申请日：2014-11-26
申请人： Intel Corporation
发明人： Khang Choong Yong , Bok Eng Cheah , Teong Keat Beh , Howard L. Heck , Jackson Chung Peng Kong , Stephen H. Hall , Kooi Chi Ooi
IPC分类号： H01L23/498 , H01L21/288 , H01L23/00 , H01L21/768 , H01L23/48
CPC分类号： H01L21/2885 , H01L21/76802 , H01L21/76879 , H01L23/48 , H01L23/49822 , H01L23/49838 , H01L23/5383 , H01L24/13 , H01L2224/1302 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01L2924/00
摘要： Some example forms relate to an electrical interconnect for an electronic package. The electrical interconnect includes a dielectric layer that includes a trench formed into one surface of the dielectric layer and a signal conductor that fills the trench and extends above the one surface of dielectric layer. The electrical interconnect further includes a conductive reference layer mounted on an opposing side of the dielectric layer. The conductive reference layer is electromagnetically coupled to the signal conductor when current passes through the signal conductor.
摘要翻译： 一些示例形式涉及电子封装的电互连。 电互连包括介电层，其包括形成在电介质层的一个表面中的沟槽和填充沟槽并在电介质层的一个表面上方延伸的信号导体。 电互连还包括安装在电介质层的相对侧上的导电参考层。 当电流通过信号导体时，导电参考层与信号导体电磁耦合。
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