Invention Grant
- Patent Title: Methods of forming stacked microelectronic dice embedded in a microelectronic substrate
- Patent Title (中): 形成微电子衬底中堆叠的微电子骰子的方法
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Application No.: US15009731Application Date: 2016-01-28
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Publication No.: US09564400B2Publication Date: 2017-02-07
- Inventor: Reinhard Mahnkopf , Wolfgang Molzer , Bernd Memmler , Edmund Goetz , Hans-Joachim Barth , Sven Albers , Thorsten Meyer
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/538 ; H01L21/768 ; H01L23/522 ; H01L23/00 ; H01L25/07 ; H01L25/00 ; H01L25/065 ; H01L23/31 ; H01L21/56
Abstract:
Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.
Public/Granted literature
- US20160148920A1 STACKED MICROELECTRONIC DICE EMBEDDED IN A MICROELECTRONIC SUBSTRATE Public/Granted day:2016-05-26
Information query
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