Invention Grant
- Patent Title: Polishing slurry and substrate polishing method using the same
- Patent Title (中): 抛光浆料和基材抛光方法使用相同
-
Application No.: US14519122Application Date: 2014-10-20
-
Publication No.: US09567490B2Publication Date: 2017-02-14
- Inventor: Seung Won Jung
- Applicant: UBMATERIALS INC.
- Applicant Address: KR
- Assignee: UBMATERIALS INC.
- Current Assignee: UBMATERIALS INC.
- Current Assignee Address: KR
- Priority: KR10-2013-0165582 20131227
- Main IPC: C09K13/00
- IPC: C09K13/00 ; C09K13/02 ; H01L21/302 ; H01L21/461 ; B44C1/22 ; C03C15/00 ; C03C25/68 ; C09G1/02 ; H01L21/321 ; C09K3/14 ; H01L21/304 ; C23F3/06
Abstract:
A polishing slurry for tungsten and a substrate polishing method are disclosed. The polishing slurry includes an abrasive for performing polishing and having positive zeta potential, and a potential modulator for promoting the oxidation of the tungsten and for controlling the zeta potential of the abrasive.
Public/Granted literature
- US20150184028A1 POLISHING SLURRY AND SUBSTRATE POLISHING METHOD USING THE SAME Public/Granted day:2015-07-02
Information query
