Invention Grant
- Patent Title: Diamond shaped source drain epitaxy with underlying buffer layer
- Patent Title (中): 具有底层缓冲层的菱形源极漏极外延
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Application No.: US14641917Application Date: 2015-03-09
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Publication No.: US09577099B2Publication Date: 2017-02-21
- Inventor: Veeraraghavan S. Basker , Eric C. T. Harley , Yue Ke , Alexander Reznicek , Henry K. Utomo
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent Yuanmin Cai; Andrew M. Calderon
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L21/00 ; H01L29/78 ; H01L29/66 ; H01L29/06 ; H01L29/08 ; H01L29/04 ; H01L29/45 ; H01L21/306

Abstract:
A semiconductor structure includes a fin upon a semiconductor substrate. A clean epitaxial growth surface is provided by forming a buffer layer upon fin sidewalls and an upper surface of the fin. The buffer layer may be epitaxially grown. Diamond shaped epitaxy is grown from the buffer layer sidewalls. In some implementations, the diamond shaped epitaxy may be subsequently merged with surrounding dielectric. A dopant concentration of the surrounding dielectric may be higher than a dopant concentration of the diamond shaped epitaxy.
Public/Granted literature
- US20160268413A1 DIAMOND SHAPED SOURCE DRAIN EPITAXY WITH UNDERLYING BUFFER LAYER Public/Granted day:2016-09-15
Information query
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