Invention Grant
- Patent Title: System and method of cleaning FOUP
- Patent Title (中): FOUP清洗系统及方法
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Application No.: US13706403Application Date: 2012-12-06
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Publication No.: US09579697B2Publication Date: 2017-02-28
- Inventor: Jyh-Shiou Hsu , Chi-Ming Yang , Kuo-Sheng Chuang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: B08B9/46
- IPC: B08B9/46 ; B08B9/08 ; H01L21/67 ; H01L21/673

Abstract:
A system for cleaning a container such as semiconductor wafer carrier includes a housing, a cleaning unit in the housing, an analyzing unit within the housing, and a vacuum unit within the housing. The cleaning unit comprises a cleaning chamber, and is configured to spray a cleaning medium into the container in the cleaning chamber and dry the container. The analyzing unit is configured to analyze air inside the container coming out of the cleaning chamber, and provide a testing result for each ingredient of possible airborne molecular contamination (AMC) and humidity. The vacuum unit comprises a vacuum chamber configured to apply vacuum onto a container when the testing result for an ingredient is higher than a respective threshold.
Public/Granted literature
- US20140158172A1 SYSTEM AND METHOD OF CLEANING FOUP Public/Granted day:2014-06-12
Information query
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