Invention Grant
- Patent Title: Apparatus and techniques for electronic device encapsulation
- Patent Title (中): 电子设备封装的装置和技术
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Application No.: US15047458Application Date: 2016-02-18
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Publication No.: US09579905B2Publication Date: 2017-02-28
- Inventor: Alexander Sou-Kang Ko , Justin Mauck , Eliyahu Vronsky , Conor F. Madigan , Eugene Rabinovich , Nahid Harjee , Christopher Buchner , Gregory Lewis
- Applicant: Kateeva, Inc.
- Applicant Address: US CA Newark
- Assignee: Kateeva, Inc.
- Current Assignee: Kateeva, Inc.
- Current Assignee Address: US CA Newark
- Priority: TW104101762A 20150120
- Main IPC: B05C5/00
- IPC: B05C5/00 ; B05C13/00 ; B05D5/00 ; H01L51/50 ; H01L51/52 ; B41J11/00 ; B05C15/00 ; H01L21/67 ; H01L51/00 ; B41J3/407 ; H01L51/56 ; H01L21/677

Abstract:
Apparatus and techniques for use in manufacturing a light emitting device, such as an organic light emitting diode (OLED) device can include using one or more modules having a controlled environment. The controlled environment can be maintained at a pressure at about atmospheric pressure or above atmospheric pressure. The modules can be arranged to provide various processing regions and to facilitate printing or otherwise depositing one or more patterned organic layers of an OLED device, such as an organic encapsulation layer (OEL) of an OLED device. In an example, uniform support for a substrate can be provided at least in part using a gas cushion, such as during one or more of a printing, holding, or curing operation comprising an OEL fabrication process. In another example, uniform support for the substrate can be provided using a distributed vacuum region, such as provided by a porous medium.
Public/Granted literature
- US20160159113A1 Apparatus and Techniques for Electronic Device Encapsulation Public/Granted day:2016-06-09
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