Invention Grant
- Patent Title: Energy efficiency aware thermal management in a multi-processor system on a chip
- Patent Title (中): 芯片上多处理器系统中的节能意识热管理
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Application No.: US14280629Application Date: 2014-05-18
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Publication No.: US09582012B2Publication Date: 2017-02-28
- Inventor: Hee Jun Park , Young Hoon Kang , Ronald Frank Alton , Christoper Lee Medrano , Jon James Anderson
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Smith Tempel
- Main IPC: G06F1/32
- IPC: G06F1/32 ; G05D23/19 ; G05B15/02 ; G06F1/20 ; G06F1/26

Abstract:
Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.
Public/Granted literature
- US20150286262A1 ENERGY EFFICIENCY AWARE THERMAL MANAGEMENT IN A MULTI-PROCESSOR SYSTEM ON A CHIP Public/Granted day:2015-10-08
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