公开(公告)号：US09977439B2

公开(公告)日：2018-05-22

申请号：US14280630

申请日：2014-05-18

Applicant: QUALCOMM INCORPORATED

Inventor： Hee Jun Park ,  Young Hoon Kang ,  Ronald Frank Alton ,  Christopher Lee Medrano ,  Jon James Anderson

IPC: G05B15/02 ,  G05D23/19 ,  G06F1/20 ,  G06F1/32 ,  G06F1/26 ,  G06F11/30 ,  G06F11/34

CPC classification number: G05D23/1917 ,  G05B15/02 ,  G06F1/203 ,  G06F1/206 ,  G06F1/26 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F11/30 ,  G06F11/34 ,  Y02D10/16

Abstract: Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.

公开(公告)号：US09578601B2

公开(公告)日：2017-02-21

申请号：US14216399

申请日：2014-03-17

Applicant: QUALCOMM Incorporated

Inventor： Vasanth Kumar Ramkumar ,  Srinivasan Rajagopalan ,  Jeffrey A. Niemann ,  Vijay Raman ,  Christopher Lee Medrano ,  Jon James Anderson ,  Amit Mahajan

IPC: H04W24/00 ,  H04W52/02 ,  G06F1/32

CPC classification number: H04W52/0251 ,  G06F1/3212 ,  G06F1/3278 ,  H04W52/0245 ,  H04W52/0277 ,  Y02D10/157 ,  Y02D10/174 ,  Y02D70/1242 ,  Y02D70/1262 ,  Y02D70/1264 ,  Y02D70/142 ,  Y02D70/146 ,  Y02D70/22 ,  Y02D70/24

Abstract: Methods, systems, and devices are described for managing power of a user equipment (UE). A UE modem may determine the state of charge of the battery to determine that the battery is in one of two or more charge state levels, and may invoke one or more modem power saving modes based on the charge state level. Power saving modes may include, for example, reducing a number of available receive chains in a UE, initiating a time delay between one or more frequency scan requests performed by the UE, reducing a rate of neighbor search requests performed by the UE, providing a buffer status report (BSR) parameter that indicates a reduced amount of buffer data relative to an actual amount of buffer data for the UE, and/or adjusting a maximum transmit power level for an uplink channel.

Abstract translation: 描述了用于管理用户设备（UE）的功率的方法，系统和设备。 UE调制解调器可以确定电池的充电状态以确定电池处于两个或多个充电状态电平之一，并且可以基于充电状态电平来调用一个或多个调制解调器功率节省模式。 省电模式可以包括例如减少UE中的可用接收链的数量，发起由UE执行的一个或多个频率扫描请求之间的时间延迟，降低由UE执行的邻居搜索请求的速率， 缓冲器状态报告（BSR）参数，其指示缓冲器数据相对于UE的实际缓冲器数据量减少的量和/或调整上行链路信道的最大发射功率电平。

公开(公告)号：US11975846B2

公开(公告)日：2024-05-07

申请号：US17247546

申请日：2020-12-16

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Don Le ,  Jon James Anderson ,  Chinchuan Chiu

IPC: B64D13/00 ,  B64C39/02 ,  B64D33/08 ,  B64U10/13 ,  B64U30/20 ,  F28D15/02 ,  F28D15/04 ,  F28D21/00

CPC classification number: B64D13/006 ,  B64C39/024 ,  B64D33/08 ,  F28D15/0275 ,  F28D15/04 ,  B64U10/13 ,  B64U30/20 ,  F28D2021/0021

Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

公开(公告)号：US11157051B2

公开(公告)日：2021-10-26

申请号：US16654166

申请日：2019-10-16

Applicant: QUALCOMM Incorporated

Inventor： Kwangyoon Lee ,  Adam Cunningham ,  Melanie Dolores Oclima ,  Ronald Alton ,  Jon James Anderson ,  Heekab Shin ,  Henri Begin

IPC: G06F1/20 ,  G06F1/324 ,  H04W52/02 ,  G06F1/3206 ,  G06F1/3296

Abstract: Various aspects of the present disclosure include methods, components and wireless devices configured to determine appropriate generalized system-wide thermal management policies and settings in wireless devices depending upon whether communication activities are driving or otherwise causing thermal conditions. In various aspects, a processor may determine workload characteristics and select and apply an appropriate thermal management policy/solution (or thermal configuration, settings etc.) based on the determine workload characteristics. The processor may determine workload characteristics based upon data from two or more temperature sensors within the wireless device. The processor may select a generalized system-wide thermal management policy suitable for operating when communication activities (e.g., 5G communication activities) are generating so much heat that CPU-centric thermal management policies are in appropriate.

公开(公告)号：US20190009878A1

公开(公告)日：2019-01-10

申请号：US15645940

申请日：2017-07-10

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Vivek Sahu ,  Shujuan Wang ,  Don Le ,  Jon James Anderson ,  Chinchuan Chiu

IPC: B64C1/06 ,  B64C39/02

Abstract: Arrangements described herein relate to apparatuses, systems, and methods for a housing of an unmanned aerial vehicle (UAV), the housing includes but is not limited to a metallic porous material having a shape of an enclosure of the UAV, and a phase change material (PCM) provided in at least a portion of the metallic porous material. The metallic porous material and the PCM are configured to passively cool the UAV.

公开(公告)号：US20170293329A1

公开(公告)日：2017-10-12

申请号：US15481665

申请日：2017-04-07

Applicant: QUALCOMM Incorporated

Inventor： Victor Adrian Chiriac ,  Jorge Luis Rosales ,  Stephen Arthur Molloy ,  Jon James Anderson

IPC: G06F1/20 ,  H01L23/427 ,  H01L23/473

CPC classification number: G06F1/20 ,  F28D15/0233 ,  F28D15/0266 ,  G06F1/203 ,  G06F1/206 ,  G06F2200/201 ,  H01L23/427 ,  H01L23/473

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.

公开(公告)号：US09606843B2

公开(公告)日：2017-03-28

申请号：US14166984

申请日：2014-01-29

Applicant: QUALCOMM Incorporated

Inventor： Jon James Anderson ,  Richard Alan Stewart

IPC: G06F9/45 ,  G06F9/50

CPC classification number: G06F9/5094 ,  G06F9/505 ,  G06F9/5066 ,  G06F9/5077

Abstract: Aspects include computing devices, systems, and methods for adjusting the assignment of tasks to processor cores in a multi-core processing system to increase operating life and maximize device performance by wear-leveling the processor cores. A reliability engine may be configured to collect operation or built in self test data of thermal output and current leakage, and historical operation time for a group of equivalent processor cores configured for the same purpose. Collected data may be applied to a weighted function to determine priorities for each equivalent processor core in the group. The reliability engine may rearrange a virtual processor identification translation table according to the priorities of the equivalent processor cores. A high level operating system may issue a process request specifying a processor core and the specified processor core may be translated to a different processor core according to the order of processor cores dictated by the priorities.

公开(公告)号：US20150169382A1

公开(公告)日：2015-06-18

申请号：US14166984

申请日：2014-01-29

Applicant: QUALCOMM Incorporated

Inventor： Jon James Anderson ,  Richard Alan Stewart

IPC: G06F9/50

CPC classification number: G06F9/5094 ,  G06F9/505 ,  G06F9/5066 ,  G06F9/5077

Abstract: Aspects include computing devices, systems, and methods for adjusting the assignment of tasks to processor cores in a multi-core processing system to increase operating life and maximize device performance by wear-leveling the processor cores. A reliability engine may be configured to collect operation or built in self test data of thermal output and current leakage, and historical operation time for a group of equivalent processor cores configured for the same purpose. Collected data may be applied to a weighted function to determine priorities for each equivalent processor core in the group. The reliability engine may rearrange a virtual processor identification translation table according to the priorities of the equivalent processor cores. A high level operating system may issue a process request specifying a processor core and the specified processor core may be translated to a different processor core according to the order of processor cores dictated by the priorities.

Abstract translation: 方面包括用于在多核处理系统中调整任务分配给处理器核心的计算设备，系统和方法，以通过磨损均衡处理器核来增加操作寿命并最大化设备性能。 可靠性引擎可以被配置为收集热输出和电流泄漏的操作或内置的自测数据，以及为相同目的配置的一组等效处理器核的历史操作时间。 收集的数据可以应用于加权函数以确定组中每个等效处理器核心的优先级。 可靠性引擎可以根据等效处理器核心的优先级重新排列虚拟处理器识别转换表。 高级操作系统可以发出指定处理器核心的处理请求，并且指定的处理器核心可以根据由优先级决定的处理器核心的顺序被转换到不同的处理器核心。

公开(公告)号：US10189554B1

公开(公告)日：2019-01-29

申请号：US15645940

申请日：2017-07-10

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Vivek Sahu ,  Shujuan Wang ,  Don Le ,  Jon James Anderson ,  Chinchuan Chiu

IPC: B60H3/00 ,  B64C1/06 ,  B64C39/02 ,  B64C1/00

Abstract: Arrangements described herein relate to apparatuses, systems, and methods for a housing of an unmanned aerial vehicle (UAV), the housing includes but is not limited to a metallic porous material having a shape of an enclosure of the UAV, and a phase change material (PCM) provided in at least a portion of the metallic porous material. The metallic porous material and the PCM are configured to passively cool the UAV.

公开(公告)号：US10082847B2

公开(公告)日：2018-09-25

申请号：US14289675

申请日：2014-05-29

Applicant: QUALCOMM INCORPORATED

Inventor： Vijay Raman ,  Amy Derbyshire ,  Christopher Medrano ,  Shiju Abraham Mathew ,  Ronald Frank Alton ,  Jon James Anderson

IPC: G06F1/20 ,  G05B11/42 ,  H01L23/34 ,  G06F1/32

CPC classification number: G06F1/206 ,  G05B11/42 ,  G06F1/203 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3296 ,  H01L23/34 ,  H01L23/345 ,  Y02D10/126

Abstract: A temperature of a component within the portable computing device (PCD) may be monitored along with a parameter associated with the temperature. The parameter associated with temperature may be an operating frequency, transmission power, or a data flow rate. It is determined if the temperature has exceeded a threshold value. If the temperature has exceeded the threshold value, then the temperature is compared with a temperature set point and a first error value is then calculated based on the comparison. Next, a first optimum value of the parameter is determined based on the first error value. If the temperature is below or equal to the threshold value, then a present value of the parameter is compared with a desired threshold for the parameter and a second error value is calculated based on the comparison. A second optimum value of the parameter may be determined based on the second error value.