Invention Grant
- Patent Title: Thermal mitigation of multi-core processor
- Patent Title (中): 多核处理器的散热
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Application No.: US14675409Application Date: 2015-03-31
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Publication No.: US09582052B2Publication Date: 2017-02-28
- Inventor: Rajat Mittal , Madan Krishnappa , Rajit Chandra , Mohammad Tamjidi
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Arent Fox LLP
- Main IPC: G06F1/26
- IPC: G06F1/26 ; G06F9/455 ; G06F1/20 ; G06F9/50 ; G06F9/48 ; G06F1/32

Abstract:
A method, an apparatus, and a computer program product are provided. The apparatus may be a UE. The UE has a processor including a plurality of cores. The plurality of cores includes a first core and remaining cores. The UE determines a temperature of the first core of the plurality of cores. The first core processes a load. The UE determines that the temperature of the first core is greater than a first threshold. The UE determines that the temperature of the first core is not greater than a second threshold. The second threshold is greater than the first threshold. The UE transfers at least a portion of the load of the first core to a second core of the remaining cores in response to determining that the temperature of the first core is greater than the first threshold.
Public/Granted literature
- US20160124476A1 THERMAL MITIGATION OF MULTI-CORE PROCESSOR Public/Granted day:2016-05-05
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