Invention Grant
- Patent Title: Two-dimensional material containing electronic components
- Patent Title (中): 含电子元件的二维材料
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Application No.: US13860612Application Date: 2013-04-11
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Publication No.: US09590044B2Publication Date: 2017-03-07
- Inventor: Guenther Ruhl , Wolfgang Lehnert , Rudolf Berger
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L29/76
- IPC: H01L29/76 ; B82Y10/00 ; H01L27/00 ; H01L31/10 ; B82Y20/00 ; H01L29/16 ; H01L29/40 ; H01L29/778 ; H01L29/861
Abstract:
In various embodiments, an electronic component is provided. The electronic component may include a dielectric structure; and a two-dimensional material containing structure over the dielectric structure. The dielectric structure is doped with dopants to change the electric characteristic of the two-dimensional material containing structure.
Public/Granted literature
- US20140306184A1 TWO-DIMENSIONAL MATERIAL CONTAINING ELECTRONIC COMPONENTS Public/Granted day:2014-10-16
Information query
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