Invention Grant
- Patent Title: Electronic assembly that includes a plurality of electronic packages
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Application No.: US14583372Application Date: 2014-12-26
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Publication No.: US09603276B2Publication Date: 2017-03-21
- Inventor: David J. Llapitan , Jeffory L. Smalley , Gaurav Chawla , Joshua D Heppner , Vijaykumar Krithivasan , Jonathan W. Thibado , Kuang Liu , Gregorio Murtagian
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K7/10

Abstract:
Some forms relate to an electronic assembly that includes a plurality of electronic package. The electronic assembly includes a frame and a first electronic package mounted on the frame. The first electronic package includes a first pin grid array. The electronic assembly further includes a second electronic package mounted on the frame. The second electronic package includes a second pin grid array. The electronic assembly further includes an actuation mechanism on the frame. The actuation mechanism is configured to move the first electronic package and the second electronic package relative to the frame during operation of the actuation mechanism.
Public/Granted literature
- US20160190717A1 ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES Public/Granted day:2016-06-30
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